×

Method and Apparatus for Thermal Management of a Radio Frequency System

  • US 20100245179A1
  • Filed: 06/10/2009
  • Published: 09/30/2010
  • Est. Priority Date: 03/24/2009
  • Status: Active Grant
First Claim
Patent Images

1. An integrated panel array assembly (IPAA) comprising:

  • (a) an active panel having first and second opposing surfaces, said active panel having a length and a width;

    (b) a plurality of active circuits mounted as flip chip circuits on the second surface of said an active panel;

    (c) a thermal management system, said thermal management system having a length which is no greater than the length of said active panel and having a width which is no greater than the width of said active panel, said thermal management system comprising;

    (1) a heat sink having first and second opposing surfaces with the first surface of said heat sink disposed on and in thermal contact with said the flip chip circuits;

    (2) a supply air distribution duct disposed over the second surface of said heat sink;

    (3) a fan disposed over said supply air distribution duct, said fan configured to direct air through said supply air distribution duct and toward the second surface of said heat sink;

    (4) a return air duct assembly in fluid communication with said supply air distribution duct; and

    (5) an exit air ducting segment in fluid communication with said return air duct assembly.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×