Miniature MEMS Condenser Microphone Package and Fabrication Method Thereof
First Claim
1. A MEMS microphone package, comprising:
- a casing with a conductive part disposed over a substrate, to enclose a cavity;
a MEMS acoustic sensing element and an IC chip disposed inside the cavity;
an opening comprising an acoustic passage connecting the cavity to an ambient space;
a first ground pad disposed on a backside of the substrate connecting to the conductive part of the casing through a via hole of the substrate; and
a second ground pad disposed on the backside of the substrate connecting to the MEMS acoustic sensing element or the IC chip through an interconnection of the substrate,wherein the first ground pad and the second ground pad are isolated from each other.
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Accused Products
Abstract
MEMS microphone packages and fabrication methods thereof are disclosed. A MEMS microphone package includes a casing with a conductive part disposed over a substrate, to enclose a cavity. A MEMS acoustic sensing element and an IC chip are disposed inside the cavity. An opening with an acoustic passage connects the cavity to an ambient space. A first ground pad is disposed on a backside of the substrate connecting to the conductive part of the casing through a via hole of the substrate. A second ground pad is disposed on the backside of the substrate connecting to the MEMS acoustic sensing element or the IC chip through an interconnection of the substrate, wherein the first ground pad and the second ground pad are isolated from each other.
147 Citations
26 Claims
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1. A MEMS microphone package, comprising:
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a casing with a conductive part disposed over a substrate, to enclose a cavity; a MEMS acoustic sensing element and an IC chip disposed inside the cavity; an opening comprising an acoustic passage connecting the cavity to an ambient space; a first ground pad disposed on a backside of the substrate connecting to the conductive part of the casing through a via hole of the substrate; and a second ground pad disposed on the backside of the substrate connecting to the MEMS acoustic sensing element or the IC chip through an interconnection of the substrate, wherein the first ground pad and the second ground pad are isolated from each other. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method for fabricating a MEMS microphone package, comprising:
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providing a substrate; forming a MEMS sensing element and an IC chip on the substrate; disposing a casing with a conductive part on the substrate, to enclose a cavity to accommodate the MEMS sensing element and the IC chip; forming an opening comprising an acoustic passage connecting the cavity to an ambient space; connecting the conductive part of the casing to a first ground pad on the backside of the substrate through a via hole; and connecting the MEMS acoustic sensing element or the IC chip to a second ground pad on the backside of the substrate through an interconnection, wherein the first ground pad and the second ground pad are isolated from each other. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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Specification