Manufacturing method of a flexible printed circuit board
First Claim
1. A manufacturing method of a flexible printed circuit board, comprising the steps of:
- (1) providing a substrate;
(2) performing a reheating and drying process to the substrate;
(3) forming a circuit pattern including at least one ground circuit, at least one X-axis circuit, at least one Y-axis circuit and at least one external circuit on a surface of the substrate;
(4) forming at least one ground circuit layer on a surface of the substrate according to the ground circuit;
(5) forming at least one Y-axis circuit layer on a surface of the substrate according to the Y-axis circuit;
(6) forming at least one X-axis circuit layer on a surface of the substrate according to the X-axis circuit; and
(7) forming a carbon paste enhancement layer at the position of the external circuit.
0 Assignments
0 Petitions
Accused Products
Abstract
In a manufacturing method of a flexible printed circuit board and its structure, the manufacturing method includes the steps of: providing a substrate; performs a preheating and drying process to the substrate; forming a circuit pattern including a ground circuit, an X-axis circuit, a Y-axis circuit and an external circuit on a surface of the substrate by a screen printing method, forming a ground circuit layer on the substrate and corresponding to the ground circuit, forming on a Y-axis circuit layer on a surface of the substrate and corresponding to the Y-axis circuit, forming an X-axis circuit layer on a surface of the substrate and corresponding to the X-axis circuit, and forming a carbon paste enhancement layer according to the external circuit.
-
Citations
13 Claims
-
1. A manufacturing method of a flexible printed circuit board, comprising the steps of:
-
(1) providing a substrate; (2) performing a reheating and drying process to the substrate; (3) forming a circuit pattern including at least one ground circuit, at least one X-axis circuit, at least one Y-axis circuit and at least one external circuit on a surface of the substrate; (4) forming at least one ground circuit layer on a surface of the substrate according to the ground circuit; (5) forming at least one Y-axis circuit layer on a surface of the substrate according to the Y-axis circuit; (6) forming at least one X-axis circuit layer on a surface of the substrate according to the X-axis circuit; and (7) forming a carbon paste enhancement layer at the position of the external circuit. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
-
Specification