HIGH VOLTAGE LOW CURRENT SURFACE EMITTING LED
First Claim
Patent Images
1. A LED chip, comprising:
- a plurality of sub-LEDs on a submount;
electrically conductive and electrically insulating features serially interconnecting said sub-LEDs such that an electrical signal applied to said serially interconnected sub-LEDs along said electrically conductive features spreads to said serially interconnected sub-LEDs; and
at least one via arranged to electrically couple at least one of said sub-LEDs to said submount.
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Abstract
An LED chip comprising a plurality of sub-LEDs on a submount. Electrically conductive and electrically insulating features are included that serially interconnect the sub-LEDs such that an electrical signal applied to the serially interconnected sub-LEDs along the electrically conductive features spreads to the serially interconnected sub-LEDs. A via is included that is arranged to electrically couple one of the sub-LEDs to the submount. The sub-LED can be interconnected by more than one of the conductive features, with each one of the conductive features capable of spreading an electrical signal between the two of the sub-LEDs.
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Citations
29 Claims
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1. A LED chip, comprising:
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a plurality of sub-LEDs on a submount; electrically conductive and electrically insulating features serially interconnecting said sub-LEDs such that an electrical signal applied to said serially interconnected sub-LEDs along said electrically conductive features spreads to said serially interconnected sub-LEDs; and at least one via arranged to electrically couple at least one of said sub-LEDs to said submount. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A LED chip, comprising:
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a plurality of sub-LEDs mounted on a submount; connector traces serially interconnecting said sub-LEDs; insulating features to insulate portions of said sub-LEDs from said connector traces; and at least one via arranged to allow for an electrical signal to pass from at least one of said sub-LEDs through said submount. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24)
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25. A LED chip, comprising:
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a plurality of sub-LEDs on a submount; and a plurality of electrically conductive features serially interconnecting at least some of said sub-LEDs, wherein at least two of said sub-LEDs are electrically interconnected by more than one of said conductive features, each one of said conductive features capable of spreading an electrical signal between said two of said sub-LEDs. - View Dependent Claims (26, 27, 28)
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29. A LED chip, comprising:
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a plurality of sub-LEDs on a submount; and a plurality of electrically conductive paths serially connecting at least some of said sub-LEDs, wherein adjacent ones of said serially connected sub-LEDs are connected by more than one of said electrically conductive paths.
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Specification