LED PACKAGE WITH INCREASED FEATURE SIZES
First Claim
1. A light emitter package, comprising:
- a submount;
a light emitter chip mounted on said submount;
a lens over said light emitter chip, the ratio of the width of said light emitter chip to the width of said lens in a given direction being 0.5 or greater.
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0 Petitions
Accused Products
Abstract
A light emitter package having increased feature sizes for improved luminous flux and efficacy. An emitter chip is disposed on a submount with a lens that covers the emitter chip. In some cases, the ratio of the width of the light emitter chip to the width of said lens in a given direction is 0.5 or greater. Increased feature sizes allow the package to emit light more efficiently. Some packages include submounts having dimensions greater than 3.5 mm square used in conjunction with larger emitter chips. Materials having higher thermal conductivities are used to fabricate the submounts, providing the package with better thermal management.
209 Citations
70 Claims
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1. A light emitter package, comprising:
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a submount; a light emitter chip mounted on said submount; a lens over said light emitter chip, the ratio of the width of said light emitter chip to the width of said lens in a given direction being 0.5 or greater. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. A light emitting diode (LED) package, comprising:
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a submount comprising a top and bottom surface; a plurality of top electrically and thermally conductive elements on said top surface of said submount; an LED chip on one of said top elements, said electrically conductive elements arranged to spread heat from said LED chip across the majority of said submount top surface; a bottom thermally conductive element on said bottom surface not in electrical contact with said top elements and arranged to conduct heat from said submount; and a lens over said LED chip; wherein the ratio of the width of said LED chip to the width of said lens in a given direction is 0.5 or greater. - View Dependent Claims (24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44)
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45. A light emitter package, comprising:
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a submount comprising aluminum nitride (AlN); a light emitter chip on said submount, said light emitter emitting light having an approximate average wavelength in the range of 430-460 nm; and a lens on said light emitter chip; wherein the ratio of the width of said light emitter chip to the width of said lens in a given direction is 0.5 or greater.
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46. A light emitter package, comprising:
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a single light emitting diode (LED) chip; a submount having dimensions of 3.5 mm square or larger; a molded lens over said LED chip on said submount. - View Dependent Claims (47, 48, 49, 50, 51, 52, 53, 54)
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55. A light emitter package, comprising:
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a light emitter chip; a submount comprising a material having a thermal conductivity of 30 W/m·
K or higher; anda molded lens over said emitter on said submount. - View Dependent Claims (56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70)
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Specification