Thermal Energy Dissipating Arrangement for a Light Emitting Diode
First Claim
1. A thermal energy dissipating arrangement for a light emitting diode (LED), comprising:
- an LED including an LED circuit having a top surface from which radiation is emitted in response to current flow through the LED circuit and an opposite bottom surface, and encapsulating material surrounding the LED circuit, the encapsulating material defining a top portion opposite the top surface of the LED circuit, a bottom portion opposite the bottom surface of the LED circuit and at least one side portion extending between the bottom portion and the top portion, anda thermal energy dissipating medium having a top surface, a bottom surface and thickness therebetween defining an opening therethrough sized to receive therein the LED such that the thickness of the thermal energy dissipating medium defining the opening is in physical, thermally conductive contact with an exterior surface of the at least one side portion of the encapsulating material of the LED, the top and bottom surfaces of the thermal energy dissipating medium each defining a length that is greater than the thickness and that extends radially away from the opening to an outer periphery,wherein the thickness of the thermally conductive medium defining the opening and in contact with the exterior surface of the at least one side portion of the encapsulating material of the LED absorbs thermal energy generated within the LED as a result of current flow through the LED circuit,and wherein the thermal energy dissipating medium rejects the absorbed thermal energy to an ambient environment surrounding the thermal energy dissipating medium through a surface area of the thermal energy dissipating medium defined by the combination of the top surface, the bottom surface and the outer periphery.
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Accused Products
Abstract
A thermal energy dissipating and LED mounting arrangement includes an LED and a thermally conductive sheet. The thermally conductive sheet has a top surface, a bottom surface and thickness therebetween defining an opening therethrough sized to receive therein the LED such that the thickness of the thermally energy dissipating medium defining the opening is in physical, thermally conductive contact with an exterior surface of the at least one side portion of the encapsulating material of the LED. The thickness defining the opening absorbs thermal energy generated within the LED as a result of current flow through the LED circuit, and the thermal energy dissipating medium rejects the absorbed thermal energy to an ambient environment surrounding the thermal energy dissipating medium through a surface area of the thermal energy dissipating medium defined by the combination of the top surface, the bottom surface and an outer periphery thereof.
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Citations
20 Claims
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1. A thermal energy dissipating arrangement for a light emitting diode (LED), comprising:
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an LED including an LED circuit having a top surface from which radiation is emitted in response to current flow through the LED circuit and an opposite bottom surface, and encapsulating material surrounding the LED circuit, the encapsulating material defining a top portion opposite the top surface of the LED circuit, a bottom portion opposite the bottom surface of the LED circuit and at least one side portion extending between the bottom portion and the top portion, and a thermal energy dissipating medium having a top surface, a bottom surface and thickness therebetween defining an opening therethrough sized to receive therein the LED such that the thickness of the thermal energy dissipating medium defining the opening is in physical, thermally conductive contact with an exterior surface of the at least one side portion of the encapsulating material of the LED, the top and bottom surfaces of the thermal energy dissipating medium each defining a length that is greater than the thickness and that extends radially away from the opening to an outer periphery, wherein the thickness of the thermally conductive medium defining the opening and in contact with the exterior surface of the at least one side portion of the encapsulating material of the LED absorbs thermal energy generated within the LED as a result of current flow through the LED circuit, and wherein the thermal energy dissipating medium rejects the absorbed thermal energy to an ambient environment surrounding the thermal energy dissipating medium through a surface area of the thermal energy dissipating medium defined by the combination of the top surface, the bottom surface and the outer periphery. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification