SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
1 Assignment
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Accused Products
Abstract
Provided are a semiconductor device and a method for fabricating the same according to an embodiment. In the method, a portion of a substrate comprising a pad is removed to form a via hole. An insulating layer is formed on the substrate. A portion of the insulating layer is removed to form an opening part comprising a plurality of openings exposing portions of the pad. A through electrode is formed to fill the via hole and to be electrically connected to the pad through one of the plurality of openings. A portion of the pad is exposed by another opening among the plurality of openings.
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Citations
21 Claims
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1-10. -10. (canceled)
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11. A semiconductor device comprising:
a substrate having a front side on which a pad is disposed and a backside opposite to the front side, the substrate having a via hole penetrating therethrough; a through electrode at least partially filling the via hole and having an upper end protruding from the front side; and an insulating layer to insulate the through electrode from the substrate, the insulating layer comprising a first opening extending through the insulating layer, through which a portion of the pad is connected to the through electrode, and a second opening exposing another portion of the pad. - View Dependent Claims (12, 13, 14, 15, 16)
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17. A semiconductor device comprising:
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a first semiconductor chip comprising a first through electrode and a first pad connected to the first through electrode, a portion of the first pad being exposed; and a second semiconductor chip stacked on the first semiconductor chip and comprising a second through electrode and a second pad connected to the second through electrode, a portion of the second pad being exposed, wherein the first and second through electrodes are connected to electrically connect the first and second semiconductor chips to each other. - View Dependent Claims (18, 19, 20)
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21-22. -22. (canceled)
Specification