STRUCTURE FOR TRANSMISSION IN POWER SUPPLY

• US 20100253155A1
• Filed: 04/06/2009
• Published: 10/07/2010
• Est. Priority Date: 04/06/2009
• Status: Active Grant

• Current Assignee: 3Y Power Technology, Inc. (FSP Technology Inc.), FSP Technology Inc.
• Original Assignee: 3Y Power Technology, Inc. (FSP Technology Inc.), FSP Technology Inc.
• Inventors: LU, Shao-Feng
• Granted Patent: US 8,274,181 B2
• Time in Patent Office: Days
• US Class Current: 307/147
• CPC Class Codes: H05K 1/0263 High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board H05K1/0293 takes precedence
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/142 Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
• CPC Class Codes: H05K 2201/10189 Non-printed connector
• CPC Class Codes: H05K 2201/1028 Thin metal strips as connectors or conductors
• CPC Class Codes: H05K 2201/10333 Individual female type metallic connector elements
• CPC Class Codes: H05K 2201/10409 Screws
• CPC Class Codes: H05K 3/366 substantially perpendicularly to each other H05K3/361 takes precedence
• CPC Class Codes: H05K 7/1432 specially adapted for power drive units or power converters
• CPC Class Codes: H05K 7/14329 specially adapted for the configuration of power bus bars

Abstract

A structure for transmission in a power supply, particularly to a power structure for transmission for bearing large DC current, wherein the power supply includes a power input port for connecting to DC input power and a DC/DC conversion circuit for converting the DC input power into DC output power. The architecture including at least one power transmission board for disposing the power input port, wherein the power transmission board is electrically connected to the power process board with the DC/DC conversion circuit mounted thereon by at least one power conduction element. Therefore, through the power conduction elements replacing the conventional connecting wires with large diameter to connect the power input port and the power process board without disobeying the safety regulation, not only the space occupied by the bent connection wires can be reduced, but the collisions and damage to other components caused therefrom also can be avoided.

Claims

1. A structure for transmission in a power supply, which includes a power input port for connecting to DC input power and a DC/DC conversion circuit for converting the DC input power into DC output power, comprising:

at least one power transmission board for disposing the power input port, wherein the power transmission board is electrically connected to a power process board with the DC/DC conversion circuit mounted thereon by at least one power conduction element.

2. The structure for transmission as claimed in claim 1, wherein the power transmission board is an EMI circuit board.

3. The structure for transmission as claimed in claim 1, wherein the power conduction element is made of rigid conductive material.

4. The structure for transmission as claimed in claim 3, wherein the power transmission board is an EMI circuit board.

5. The structure for transmission as claimed in claim 3, wherein the power transmission board is made of copper or aluminum.

6. The structure for transmission as claimed in claim 5, wherein the power transmission board is an EMI circuit board.

7. The structure for transmission as claimed in claim 3, wherein the power transmission board and the power process board both have electrical connection pins corresponding to each other for mounting and positioning the power conduction elements so as to achieve the electrical connection therebetween.

8. The structure for transmission as claimed in claim 7, wherein the power transmission board is an EMI circuit board.

9. The structure for transmission as claimed in claim 7, wherein the connection between the power conduction elements and the electrical connection pins is achieved by screw, terminal, solder or plug.

10. The structure for transmission as claimed in claim 1, wherein the number of the power transmission board is implemented to be plural which are a first power transmission board and a second power transmission board, and the number of the power conduction element is implemented to be plural which are a first power conduction element and a second power conduction element.

11. The structure for transmission as claimed in claim 10, wherein the first power transmission board is an EMI circuit board.

12. The structure for transmission as claimed in claim 10, wherein the second power transmission board has an overload protector mounted thereon.

13. The structure for transmission as claimed in claim 10, wherein the first and the second power conduction elements are made of rigid conductive material.

14. The structure for transmission as claimed in claim 13, wherein the first power transmission board is an EMI circuit board.

15. The structure for transmission as claimed in claim 13, wherein the second power transmission board has an overload protector mounted thereon.

16. The structure for transmission as claimed in claim 13, wherein the first and the second power conduction elements are made of copper or aluminum.

17. The structure for transmission as claimed in claim 13, wherein the first power transmission board and the second power transmission board both have electrical connection pins corresponding to each other for mounting and positioning the first power conduction elements so as to achieve the electrical connection therebetween.

18. The structure for transmission as claimed in claim 17, wherein the connections between the first and second power conduction elements and the electrical connection pins are achieved by screw, terminal, solder or plug.

19. The structure for transmission as claimed in claim 13, wherein the second power transmission board and the power process board both have electrical connection pins corresponding to each other for mounting and positioning the second power conduction elements so as to achieve the electrical connection therebetween.

20. The structure for transmission as claimed in claim 19, wherein the connections between the second power conduction elements and the electrical connection pins are achieved by screw, terminal, solder or plug.