Micro-image acquisition and transmission system

• US 20100253179A1
• Filed: 04/01/2010
• Published: 10/07/2010
• Est. Priority Date: 04/06/2009
• Status: Active Grant

• Current Assignee: PFG Ip, LLC
• Original Assignee: Irvine Sensors Corp.
• Inventors: Hsu, Ying
• Granted Patent: US 8,362,673 B2
• Time in Patent Office: Days
• US Class Current: 310/300
• CPC Class Codes: G02B 26/0833 the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD G02B26/0825 takes precedence; micromechanical devices in general B81B
• CPC Class Codes: H01R 39/20 characterised by the material thereof

Abstract

A micro-image acquisition and transmission system is provided. In a preferred embodiment, the system is comprised of an image acquisition chip comprising an electronic imager, control electronics and a micro powered rotary stage comprising a transceiver array that acts as a hub to optically link a group of distributed image acquisition chips. A preferred embodiment is further comprised of a transceiver array chip comprising one or more micro-powered rotary stages having a transceiver array assembly disposed thereon. The micro-powered rotary stage is supported by a micro-brush bearing.

Claims

1. A micro-brush bearing comprising at least one electrically conductive column comprising a semiconductor material.

2. The micro-brush bearing of claim 1 wherein said electrically conductive column is comprised of silicon.

3. The micro-brush bearing of claim 1 wherein said electrically conductive column is substantially circular in cross-section along its length.

4. The micro-brush bearing of claim 1 wherein said electrically conductive column is substantially cylindrical in cross-section along its length.

5. The micro-brush bearing of claim 1 wherein said electrically conductive column is tapered along it length.

6. A micro-powered rotary stage comprising:

a micro-brush bearing comprising at least one electrically conductive column comprising

a semiconductor material,

at least one capacitive feed-through,

a micro-friction drive,

a plurality of cantilever teeth.

7. The micro-powered rotary stage of claim 6 further comprising at least one electrostatic balancer.

8. The micro-powered rotary stage of claim 6 further comprising a rotary encoder and an encoder reader.

9. The micro-powered rotary stage of claim 6 further comprising further a transceiver array chip comprising a micro-steerable mirror assembly comprising a scratch drive.

10. The micro-powered rotary stage of claim 6 further comprising further comprising an image acquisition chip.

11. The micro-powered rotary stage of claim 6 wherein said electrically conductive column is comprised of silicon.

12. The micro-powered rotary stage of claim 6 wherein said electrically conductive column is substantially circular in cross-section along its length.

13. The micro-powered rotary stage of claim 6 wherein said electrically conductive column is substantially cylindrical in cross-section along its length.

14. The micro-powered rotary stage of claim 6 wherein said electrically conductive column is tapered along it length.

15. A transceiver array chip comprising at least one micro-steerable mirror assembly comprising a scratch drive.