MINIATURE SHIELDED MAGNETIC COMPONENT AND METHODS OF MANUFACTURE

• US 20100253456A1
• Filed: 04/23/2010
• Published: 10/07/2010
• Est. Priority Date: 06/15/2007
• Status: Abandoned Application

• Current Assignee: Cooper Technologies Company (Eaton Corporation PLC.)
• Original Assignee: Cooper Technologies Company (Eaton Corporation PLC.)
• Inventors: Yan, Yipeng, Bogert, Robert James
• Application Number:
  US12/765,972
• Publication Number:
  US 20100253456A1
• Time in Patent Office: Days
• US Class Current: 336/83
• CPC Class Codes: H01F 17/045 with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core
• CPC Class Codes: H01F 27/263 Fastening parts of the core together
• CPC Class Codes: H01F 27/292 Surface mounted devices
• CPC Class Codes: H01F 27/306 Fastening or mounting coils or windings on core, casing or other support
• CPC Class Codes: H01F 3/14 Constrictions; Gaps, e.g. air-gaps in magnetic shunt paths H01F3/12
• CPC Class Codes: Y10T 29/49073 by assembling coil and core

Abstract

Low profile magnetic components and methods of manufacture include first and second core pieces extending interior and exterior to an open center area of a coil. Surface mount terminations are also provided to complete electrical connections to a circuit board.

Claims

1. A low profile magnetic component comprising:

at least one conductive coil having an open center area;

an inner magnetic core piece extending through the open center area;

an outer magnetic core piece surrounding the coil and the portion of the first core piece; and

surface mount terminations for completing electrical connections between a circuit board and the at least one conductive coil.

2. The low profile magnetic component of claim 1, wherein the inner magnetic core piece is substantially cylindrical.

3. The low profile magnetic component of claim 1, wherein the inner magnetic core piece extends entirely through the open center area.

4. The low profile magnetic component of claim 1, wherein the outer magnetic core piece and the inner magnetic core piece are fabricated from different magnetic materials.

5. The low profile magnetic component of claim 1, wherein the inner magnetic core piece is completely embedded in the outer magnetic core piece.

6. The low profile magnetic component of claim 1, wherein the inner core piece comprises a first portion having a first diameter, and a second portion having a second diameter larger than the first diameter, the first portion extending through the open center area.

7. The low profile magnetic component of claim 1, wherein the outer magnetic core piece is fabricated from layers of magnetic material.

8. The low profile magnetic component of claim 7, wherein the layers of magnetic material include powdered magnetic particles mixed with a polymeric binder.

9. The low profile magnetic component of claim 7, wherein at least two of the magnetic layers are fabricated from different magnetic materials.

10. The low profile magnetic component of claim 1, wherein at least one of the inner core piece and the outer core piece is fabricated from powdered magnetic particles mixed with a polymeric binder.

11. The low profile magnetic component of claim 1, wherein the outer magnetic core piece is formed over the coil and the inner magnetic core piece.

12. The low profile magnetic component of claim 1, wherein the inner magnetic core piece extends less than an entire axial distance through the open center area when the inner and outer core pieces are assembled, thereby forming a gap between the inner and outer magnetic core pieces.

13. The low profile magnetic component of claim 1, wherein the inner and outer magnetic core pieces form a monolithic core structure.

14. The low profile magnetic component of claim 13, wherein the monolithic core structure does not include a physical gap.

15. The low profile magnetic component of claim 1, wherein the surface mount terminations comprise first and second conductive clips receiving the first and second coil leads, respectively.

16. The low profile magnetic component of claim 1, wherein the coil comprises an inner periphery and an outer periphery, wherein each of the first and second leads connect to the coil at the outer periphery.

17. The low profile magnetic component of claim 1, wherein the component is a power inductor.

18. The low profile magnetic component of claim 1, wherein the outer magnetic core piece is fabricated independently from the inner magnetic core piece.

19. A method of manufacturing a low profile magnetic component comprising:

providing a first core fabricated from a magnetic permeable material;

providing a coil formed independently from the first core, the coil including first and second leads and a plurality of turns therebetween;

extending at least a portion of the first core in an open center area of the coil;

coupling a second core fabricated from a magnetic permeable material to the first core; and

providing surface mount terminations on the second core.

20. The method of claim 19, wherein coupling the second core comprises forming the second core over the coil and first core, thereby embedding the first core and coil in the second core.

21. The method of claim 20, wherein forming the first core over the coil and first core comprises molding the second cover over the coil and first core.

22. The method of claim 21, wherein forming the first core comprises compression molding a material including powdered magnetic particles and a binder.

23. The method of claim 22, wherein compression molding comprises stacking sheets of magnetic layers and laminating the layers.

24. The method of claim 19 wherein the coil includes an inner periphery and an outer periphery and wherein each of the first and second distal ends connect to the coil at the outer periphery, the method further including connecting the first and second distal ends to the surface mount terminations.

25. The method of claim 19, further comprising connecting the first and second distal ends to the surface mount terminations.

26. The method of claim 25 further comprising providing pre-formed terminal clips defining the surface mount terminations.