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TOUCH SENSOR WITH MODULAR SENSING COMPONENTS

  • US 20100253648A1
  • Filed: 04/01/2010
  • Published: 10/07/2010
  • Est. Priority Date: 04/06/2009
  • Status: Abandoned Application
First Claim
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1. ) A contact sensitive device comprising:

  • a first substrate capable of propagating bending wave vibration and having a touch surface;

    at least one sensor board coupled to the substrate, the sensor board including a second substrate onto which is mounted a sensor for measuring bending wave vibration of the first substrate; and

    a processor communicatively coupled to the at least one sensor board for processing information from the sensor related to a contact made on the touch surface.

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