TOUCH SENSOR WITH MODULAR SENSING COMPONENTS
First Claim
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1. ) A contact sensitive device comprising:
- a first substrate capable of propagating bending wave vibration and having a touch surface;
at least one sensor board coupled to the substrate, the sensor board including a second substrate onto which is mounted a sensor for measuring bending wave vibration of the first substrate; and
a processor communicatively coupled to the at least one sensor board for processing information from the sensor related to a contact made on the touch surface.
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Abstract
A bending wave-type touch sensor for resolving contacts to a substrate, the touch sensor comprised of a plurality of sensor boards coupled to the substrate.
30 Citations
18 Claims
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1. ) A contact sensitive device comprising:
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a first substrate capable of propagating bending wave vibration and having a touch surface; at least one sensor board coupled to the substrate, the sensor board including a second substrate onto which is mounted a sensor for measuring bending wave vibration of the first substrate; and a processor communicatively coupled to the at least one sensor board for processing information from the sensor related to a contact made on the touch surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. ) An apparatus comprising:
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a circuit board having at least two conductive pads on a first circuit board surface, the two conductive pads each having a surface area; a sensor capable of sensing bending waves, the sensor having at least two conductive connection points on a first sensor surface, the first sensor surface having a surface area; wherein at least a portion of each of the at least two sensor pads are mechanically and electrically coupled to at least two areas of the first sensor surface that include the two conductive connection points; and wherein the surface area of the first sensor surface that is mechanically coupled to the two pads is greater than 20% of the total first sensor surface area. - View Dependent Claims (10, 11, 12)
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13. ) A method of making a touch sensitive device comprising:
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mechanically coupling at least three sensor boards to a substrate, the sensor boards each including at least a piezoelectric sensor capable of measuring bending waves and providing signals indicative of measured bending waves; communicatively coupling the at least three sensor boards to electronics, the electronics configured to receive signals from the piezoelectric sensor and based on these signals provide signals indicative of the coordinates of a contact made to the substrate. - View Dependent Claims (14, 15, 16, 17, 18)
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Specification