METALLIZATION PROCESS AND PRODUCT PRODUCED THEREBY

• US 20100255265A1
• Filed: 06/17/2010
• Published: 10/07/2010
• Est. Priority Date: 03/05/2004
• Status: Abandoned Application

• Current Assignee: Unifoil Corporation
• Original Assignee: Unifoil Corporation
• Inventors: Funicelli, Joseph, Gallino, Robert
• Application Number:
  US12/817,277
• Publication Number:
  US 20100255265A1
• Time in Patent Office: Days
• US Class Current: 428/172
• CPC Class Codes: B44C 1/1737 Decalcomanias provided with a particular decorative layer, e.g. specially adapted to allow the formation of a metallic or dyestuff on a substrate unsuitable for direct deposition
• CPC Class Codes: Y10T 428/24612 Composite web or sheet
• CPC Class Codes: Y10T 428/24917 including metal layer
• CPC Class Codes: Y10T 428/25 Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
• CPC Class Codes: Y10T 428/26 Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
• CPC Class Codes: Y10T 428/265 1 mil or less
• CPC Class Codes: Y10T 428/31507 Of polycarbonate
• CPC Class Codes: Y10T 428/31678 Of metal
• CPC Class Codes: Y10T 428/31681 Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
• CPC Class Codes: Y10T 428/31692 Next to addition polymer from unsaturated monomers
• CPC Class Codes: Y10T 442/3382 Including a free metal or alloy constituent
• CPC Class Codes: Y10T 442/654 Including a free metal or alloy constituent

Abstract

A layered structure produced by metallizing a substrate including: (a) providing a transfer film including film layer and metal layer bonded together by a cured breakaway layer; (b) providing a substrate; (c) applying electron beam curable transfer adhesive to a portion of the substrate; (d) securing the transfer film to the substrate, where the transfer adhesive is between the metal layer and substrate, forming an intermediate product; (e) passing the intermediate product through an electron beam curing apparatus to cure the transfer adhesive; and (f) removing the transfer film. In the metallized product, the cured breakaway coating is bonded only to the metal. The cured breakaway layer preferably has a cured elongation at break, in tension, of less than about 20%. Precise metallized edges are produced, e.g., edge variation of about ±0.010 in., or better. The process can be utilized with total or selective metal transfer.

Claims

1. A selectively metallized layered structure comprising at least one each of:

(a) a substrate layer having a predetermined total area;

(b) a metal-containing layer comprising selectively metallized portions;

(c) an adhesive layer adhering said selectively metallized portions of said metal-containing metal layer to said substrate layer; and

(d) a pre-cured breakaway layer, having a top surface and a bottom surface, said bottom surface of said pre-cured breakaway layer having been pre-cured prior to coating only said selectively metallized portions of said metal-containing layer, whereby said metal-containing layer, said adhesive layer, and said pre-cured breakaway layer cover only a portion of said predetermined total area of said substrate layer.

2. The selectively metallized layered structure of claim 1 having at least two selectively metallized areas, each said area having at least one metallized edge, said edges separated from one another by a non-metallized area, thereby providing adjoining metallized edges.

3. The selectively metallized layered structure of claim 2 wherein the distance between said adjoining metallized edges varies by less than or equal to about ±

0.010 inches.

4. The selectively metallized layered structure of claim 3 wherein said distance varies by less than or equal to about ±

0.0010 inches.

5. A selectively metallized layered structure comprising at least one each of:

(a) a substrate layer having a predetermined total area;

(b) a metal-containing layer comprising selectively metallized portions;

(c) an adhesive layer adhering said selectively metallized portions of said metal-containing metal layer to said substrate layer; and

(d) a pre-cured breakaway layer, having a top surface and a bottom surface, said bottom surface of said pre-cured breakaway layer coating only said selectively metallized portions of said metal-containing layer.

6. The selectively metallized layered structure of claim 5 having at least two selectively metallized portions, each said portion having at least one metallized edge, said edges separated from one another by a non-metallized portion, thereby providing adjoining metallized edges.

7. The selectively metallized layered structure of claim 6 wherein the distance between said adjoining metallized edges varies by less than or equal to about ±

0.010 inches.

8. The selectively metallized layered structure of claim 7 wherein said distance varies by less than or equal to about ±

0.0010 inches.

9. A selectively metallized layered structure comprising at least one each of:

(a) a nonporous substrate layer having a predetermined total area;

(b) a metal-containing layer comprising selectively metallized portions;

(c) an adhesive layer adhering said selectively metallized portions of said metal-containing layer to said substrate layer, said adhesive layer comprising a radiation-curable adhesive material; and

(d) a pre-cured breakaway layer having a top surface and a bottom surface, said bottom surface of said pre-cured breakaway layer having been pre-cured prior to coating said selectively metallized portions of said metal-containing layer, whereby said metal-containing layer, said adhesive layer, and said pre-cured breakaway layer cover only a portion of said predetermined total area of said substrate layer.

10. The selectively metallized layered structure of claim 9 wherein said nonporous substrate layer comprises a polymer.

11. The selectively metallized layered structure of claim 10 wherein said polymer is selected from the group consisting of polypropylene, polyester, polyethylene, polycarbonate, acrylic, polyamide, polyvinyl chloride, polystyrene, cellophane, polyethylene terephthalate, ethylene-vinyl alcoholate, polyacrylonitrile, cellulose acetate butyrate, nylon, polyvinyl alcohol, ethylene-vinyl acetate, polyurethane, polymethyl methacrylate, polylactic acid and polycaprolactone.

12. The selectively metallized layered structure of claim 9 having at least two selectively metallized areas, each said area having at least one metallized edge, said edges separated from one another by a non-metallized area, thereby providing adjoining metallized edges.

13. The selectively metallized layered structure of claim 12 wherein the distance between said adjoining metallized edges varies by less than or equal to about +/−

0.010 inches.

14. The selectively metallized layered structure of claim 9 wherein said radiation-curable adhesive layer comprises an electron beam curable adhesive layer.