HIGH TEMPERATURE RESISTANT INSULATING COMPOSITION, INSULATING WIRE AND MAGNETIC ELEMENT

• US 20100255282A1
• Filed: 04/05/2010
• Published: 10/07/2010
• Est. Priority Date: 04/07/2009
• Status: Abandoned Application

• Current Assignee: Delta Electronics Incorporated
• Original Assignee: Delta Electronics Incorporated
• Inventors: Yang, Wei, Ying, Jian-Ping, Zeng, Jian-Hong, Hong, Shou-Yu
• Application Number:
  US12/754,021
• Publication Number:
  US 20100255282A1
• Time in Patent Office: Days
• US Class Current: 428/222
• CPC Class Codes: H01F 1/22 pressed, sintered, or bound together
• CPC Class Codes: H01F 1/36 in the form of particles H01F1/346, H01F1/348 and H01F1/38 take precedence
• CPC Class Codes: H01F 17/04 with magnetic core
• CPC Class Codes: H01F 2017/048 with encapsulating core, e.g. made of resin and magnetic powder
• CPC Class Codes: H01F 3/08 made from powder powder coatings on sheets H01F3/02; on strips or ribbons H01F3/04; on wires H01F3/06
• CPC Class Codes: H01F 41/0246 Manufacturing of magnetic circuits by moulding or by pressing powder magnetic cores made by moulding or by pressing powder H01F27/255; soft magnetic particles H01F1/20, H01F1/36
• CPC Class Codes: H01F 5/06 Insulation of windings
• CPC Class Codes: Y10T 428/249922 Embodying intertwined or helical component[s]
• CPC Class Codes: Y10T 428/2933 Coated or with bond, impregnation or core

Abstract

A high temperature resistant insulating composition includes an organic polymer and an inorganic binder. The inorganic binder is ranged between 10% and 90% by weight of the high temperature resistant insulating composition. The high temperature resistant insulating composition still possesses strength and insulating property after a high temperature treatment.

Claims

1. A high temperature resistant insulating composition comprising:

an organic polymer; and

an inorganic binder ranged between 10% and 90% by weight of said high temperature resistant insulating composition,

wherein said high temperature resistant insulating composition still possesses strength and insulating property after a high temperature treatment.

2. The high temperature resistant insulating composition according to claim 1 wherein a high temperature residual of the organic polymer after said high temperature treatment has a volume resistivity higher than 1MΩ

meter.

3. The high temperature resistant insulating composition according to claim 1 wherein said organic polymer is completely vaporized after said high temperature treatment at a predetermined temperature.

4. The high temperature resistant insulating composition according to claim 1 wherein said organic polymer includes organic silicon resin, polyimide, polyester, polyesterimide, polyamideimide, or a combination thereof.

5. The high temperature resistant insulating composition according to claim 1 wherein said inorganic binder is an inorganic sintered binder.

6. The high temperature resistant insulating composition according to claim 1 wherein said inorganic binder includes low melting glass powder, low melting glass coated ceramic granule/fiber, a mixture of glass and ceramic, a mixture of boric anhydride and aluminum oxide, or a combination thereof.

7. The high temperature resistant insulating composition according to claim 1 wherein the softening/sintering temperature of said inorganic binder is lower than a predetermined temperature.

8. The high temperature resistant insulating composition according to claim 1 wherein said organic polymer is organic silicon resin and said inorganic binder is a low melting glass powder.

9. The high temperature resistant insulating composition according to claim 1 wherein said temperature resistant insulating composition has flexibility and toughness at a low temperature between −

60°

C. to about 200°

C.

10. The high temperature resistant insulating composition according to claim 1 wherein said high temperature resistant insulating composition after said high temperature treatment between 400°

C. and 1000°

C. still possesses strength and insulating property.

11. An insulating wire comprising:

a conductive wire; and

an insulating coating layer sheathing around said conductive wire and made of a high temperature resistant insulating composition, wherein said high temperature resistant insulating composition comprises an organic polymer and an inorganic binder ranged between 10% and 90% by weight of said high temperature resistant insulating composition, and said high temperature resistant insulating composition after a high temperature treatment still possesses strength and insulating property.

12. The insulating wire according to claim 11 wherein said insulating coating layer has a thickness ranged from 5 μ

m to 200 μ

m.

13. The insulating wire according to claim 11 wherein said conductive wire is wound into a coil and accommodated at least partially within a magnetic material, said magnetic material is compacted and subject to a high temperature treatment at a temperature above 400°

C. to produce a magnetic body, and said coil and said magnetic body are collectively formed into a magnetic element.

14. The insulating wire according to claim 13 wherein said magnetic material is FeAlSi magnetic powder, FeNi magnetic powder, FeNiMo magnetic powder, FeSi magnetic powder, FeSiCr magnetic powder, or ferrite material.

15. The insulating wire according to claim 13 wherein said insulating coating layer has a thermal expansion coefficient ranged between said conductive wire and said magnetic material.

16. The insulating wire according to claim 13 wherein the softening/sintering point of said inorganic binder is lower than the annealing/sintering temperature of said magnetic material.

17. The insulating wire according to claim 11 wherein the oxygen content of the conductive wire is lower than 200 ppm.

18. A magnetic element comprising:

a magnetic body; and

an insulating wire is wound into a coil and at least partially accommodated within said magnetic body, and comprising a conductive wire and an insulating coating layer, wherein said insulating coating layer is sheathed around said conductive wire and made of a high temperature resistant insulating composition, said high temperature resistant insulating composition comprises an organic polymer and an inorganic binder ranged between 10% and 90% by weight of said high temperature resistant insulating composition, and said high temperature resistant insulating composition after a high temperature treatment still possesses strength and insulating property

19. The magnetic element according to claim 18 wherein said magnetic body is made of a magnetic material, and said magnetic material is compacted and subject to a high temperature treatment at a temperature above 400°

C. to produce said magnetic body.

20. The magnetic element according to claim 19 wherein said magnetic material is FeAlSi magnetic powder, FeNi magnetic powder, FeNiMo magnetic powder, FeSi magnetic powder, FeSiCr magnetic powder, or ferrite material, said inorganic binder includes low melting glass powder, lower melting glass coated ceramic granule/fiber, a mixture of glass and ceramic, a mixture of boric anhydride and aluminum oxide, or a combination thereof, and said organic polymer includes organic silicon resin, polyimide, polyester, polyesterimide, polyamideimide, or a combination thereof.