Shielding Arrangement for Electronic Device
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Accused Products
Abstract
A shielding arrangement for an electronic component mounted on a circuit board includes a shield formed by a frame sidewall arranged to be oriented upstanding from the circuit board and surrounding the electronic component mounted on the circuit board. A first cover portion substantially closes the surrounding sidewall, enclosing the electronic component on the circuit board. A conductive layer, formed by vacuum deposition covers an inside surface of the surrounding sidewall and an inside surface of the first cover portion, continuously. As an alternative to the conductive layer, the frame can be composed of an electrically conductive plastic. The first cover portion can be a stamped metal plate integrated with the frame by overmolding.
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Citations
41 Claims
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1-3. -3. (canceled)
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4. A method of manufacturing a shield for an electronic component, comprising the steps of:
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providing an enclosure having a surrounding sidewall and a metal first cover portion; and depositing a layer of electrically conductive material on the inside facing surface of said sidewall and said first cover portion to cover said inside facing surface of sidewall and said first cover portion. - View Dependent Claims (5, 6, 7, 8, 9)
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10-27. -27. (canceled)
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28. A method of making a shield for an electronic component, comprising the steps of:
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providing an enclosure having a surrounding sidewall and a first cover portion, the first cover portion being opposite an open side; and covering the inside facing surface of said sidewall and said first cover portion with a layer of electrically conductive material. - View Dependent Claims (29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39)
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40. A method of shielding an electronic component, comprising the steps of:
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providing an first enclosure having a surrounding sidewall and a first cover portion, the first cover portion being opposite an open side; depositing a layer of electrically conductive material on the inside facing surface of said sidewall and said first cover portion to cover said inside facing surface of sidewall and said first cover portion; arranging a conductive adhesive continuously between facing surfaces of said first sidewall and a circuit board; placing said enclosure onto a first side of said circuit board; and allowing said adhesive to cure to fix said enclosure to said circuit board. - View Dependent Claims (41)
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Specification