Shielding Arrangement for Electronic Device

• US 20100257732A1
• Filed: 04/14/2009
• Published: 10/14/2010
• Est. Priority Date: 04/14/2009
• Status: Abandoned Application

• Current Assignee: Frank J. Ziberna
• Original Assignee: Frank J. Ziberna
• Inventors: Ziberna, Frank J.
• Application Number:
  US12/423,312
• Publication Number:
  US 20100257732A1
• Time in Patent Office: Days
• US Class Current: 29/846
• CPC Class Codes: H05K 5/0269 Card housings therefor, e.g. covers, frames, PCB
• CPC Class Codes: H05K 9/0032 having multiple parts, e.g. frames mating with lids
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

A shielding arrangement for an electronic component mounted on a circuit board includes a shield formed by a frame sidewall arranged to be oriented upstanding from the circuit board and surrounding the electronic component mounted on the circuit board. A first cover portion substantially closes the surrounding sidewall, enclosing the electronic component on the circuit board. A conductive layer, formed by vacuum deposition covers an inside surface of the surrounding sidewall and an inside surface of the first cover portion, continuously. As an alternative to the conductive layer, the frame can be composed of an electrically conductive plastic. The first cover portion can be a stamped metal plate integrated with the frame by overmolding.

Claims

1-3. -3. (canceled)

4. A method of manufacturing a shield for an electronic component, comprising the steps of:

providing an enclosure having a surrounding sidewall and a metal first cover portion; and

depositing a layer of electrically conductive material on the inside facing surface of said sidewall and said first cover portion to cover said inside facing surface of sidewall and said first cover portion.

5. The method according to claim 4, wherein said step of depositing is further defined in that said layer is deposited continuously on said inside surface of said sidewall and on an inside surface of said metal first cover portion to effectively cover said inside surface of said sidewall and said inside surface of said metal first cover portion.

6. The method according to claim 5 wherein said step of depositing is further defined in that said step of depositing is a vacuum deposition step.

7. The method according to claim 6, wherein said step of providing said enclosure is further defined by the steps of:

providing a stamped metal plate;

inserting said stamped metal plate into a mold;

injecting molten polymer or plastic into said mold to form said surrounding sidewall;

allowing said molten polymer or plastic to harden to integrate said sidewall with said stamped metal plate.

8. The method according to claim 7, wherein said step of depositing is further defined by the steps of:

placing said enclosure into a vacuum chamber;

arranging a supply of a metal within said vacuum chamber;

heating said supply of said metal;

evacuating said vacuum chamber;

depositing said conductive layer continuously on said inside surface of said surrounding sidewall and on an inside surface of said first cover portion.

9. The method according to claim 8, comprising the further steps of:

arranging a conductive adhesive continuously between facing surfaces of said sidewall and a circuit board;

placing said enclosure onto said circuit board; and

allowing said adhesive to cure to fix said enclosure to said circuit board.

10-27. -27. (canceled)

28. A method of making a shield for an electronic component, comprising the steps of:

providing an enclosure having a surrounding sidewall and a first cover portion, the first cover portion being opposite an open side; and

covering the inside facing surface of said sidewall and said first cover portion with a layer of electrically conductive material.

29. The method according to claim 28, wherein said step of covering is further defined in that said layer is deposited continuously on said inside surface of said sidewall and on an inside surface of said first cover portion to effectively cover said inside surface of said sidewall and said inside surface of said metal first cover portion.

30. The method according to claim 28 wherein said step of covering comprises the step of depositing by vacuum deposition the electrically conductive material on the inside facing surface of said sidewall and said first cover portion.

31. The method according to claim 28, wherein said step of providing said enclosure is further defined by the steps of:

providing a stamped metal plate as the first cover portion;

inserting said stamped metal plate into a mold;

injecting molten polymer or plastic into said mold to form said surrounding sidewall;

allowing said molten polymer or plastic to harden to integrate said sidewall with said stamped metal plate.

32. The method according to claim 28, wherein said step of covering is further defined by the steps of:

placing said enclosure into a vacuum chamber;

arranging a supply of a metal within said vacuum chamber;

heating said supply of said metal;

evacuating said vacuum chamber;

depositing said conductive layer continuously on said inside surface of said surrounding sidewall and on an inside surface of said first cover portion.

33. The method according to claim 28, comprising the further steps of:

arranging a conductive adhesive continuously between facing surfaces of said sidewall and a circuit board;

placing said enclosure onto said circuit board; and

allowing said adhesive to cure to fix said enclosure to said circuit board.

34. The method according to claim 28, wherein the step of providing comprises the step of providing an enclosure having a plurality of chambers, each chamber having a surrounding sidewall and a first cover portion;

at least two adjacent chambers share a common side wall portion.

35. The method according to claim 28, wherein the step of providing comprises the steps of:

providing holes in the side wall;

placing the side wall in a frame mold;

inserting molten polymer or plastic into said frame mold to form a frame around the sidewall and filling the holes; and

allowing the molten polymer or plastic to harden.

36. The method of claim 35, wherein the step of providing holes is further defined by providing horizontal holes.

37. The method of claim 34, wherein the step of providing comprises the steps of:

providing a tab portion extending downward from the cover at a position interior of the sidewall;

placing the tab portion in a frame mold;

inserting molten polymer or plastic into said frame mold surrounding the tab and extending therefrom; and

allowing the molten polymer or plastic to harden to form an interior wall that divides the enclosure into at least two chambers.

38. The method of claim 37, wherein the step of providing a tab portions and placing comprises the step of:

providing a plurality of tabs aligned to be integrally molded within the interior wall.

39. The method of claim 37, wherein the step of providing a tab portion comprises the steps of:

cutting a tab portion in the cover;

bending the tab portion downward to leave a gap portion in the cover; and

wherein the step of inserting molten polymer or plastic further comprises the step of inserting molten polymer or plastic to fill the gap portion.

40. A method of shielding an electronic component, comprising the steps of:

providing an first enclosure having a surrounding sidewall and a first cover portion, the first cover portion being opposite an open side;

depositing a layer of electrically conductive material on the inside facing surface of said sidewall and said first cover portion to cover said inside facing surface of sidewall and said first cover portion;

arranging a conductive adhesive continuously between facing surfaces of said first sidewall and a circuit board;

placing said enclosure onto a first side of said circuit board; and

allowing said adhesive to cure to fix said enclosure to said circuit board.

41. The method of claim 40, comprising the steps of:

providing an second enclosure having a second surrounding sidewall and a second cover portion, the second cover portion being opposite an open side;

depositing a layer of electrically conductive material on an inside facing surface of said second sidewall and said second cover portion to cover said inside facing surface of said second sidewall and said second cover portion;

arranging a conductive adhesive continuously between facing surfaces of said second sidewall and the circuit board;

placing the second enclosure onto said circuit board on a second side opposite the first side;

connecting an outer perimeter portion of the first sidewall with an outer perimeter portion of the second sidewall; and

allowing said adhesive to cure to fix said first and second enclosures to said circuit board and the outer perimeter portion of the first sidewall to the outer perimeter portion of the second sidewall.