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BONDED HERMETIC FEED THROUGH FOR AN ACTIVE IMPLANTABLE MEDICAL DEVICE

  • US 20100258342A1
  • Filed: 08/28/2009
  • Published: 10/14/2010
  • Est. Priority Date: 04/08/2009
  • Status: Abandoned Application
First Claim
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1. A method for manufacturing a feed through for an implantable medical device, comprising:

  • forming an aperture through each of first and second substantially planar, electrically non-conductive and fluid impermeable substrates usable for semiconductor fabrication;

    metalizing a region of a surface of the first substrate to form a contiguous metalized layer that is co-existent with a section of the perimeter of the aperture and extends from the aperture;

    metalizing a region of a surface of the second substrate to form a contiguous metalized layer that is co-existent with a section of the perimeter of the aperture and extends from the aperture;

    bonding the metalized layers to one another such that the apertures are not aligned with one another, and such that the metalized layers form a conductive pathway between the apertures.

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