BONDED HERMETIC FEED THROUGH FOR AN ACTIVE IMPLANTABLE MEDICAL DEVICE
First Claim
1. A method for manufacturing a feed through for an implantable medical device, comprising:
- forming an aperture through each of first and second substantially planar, electrically non-conductive and fluid impermeable substrates usable for semiconductor fabrication;
metalizing a region of a surface of the first substrate to form a contiguous metalized layer that is co-existent with a section of the perimeter of the aperture and extends from the aperture;
metalizing a region of a surface of the second substrate to form a contiguous metalized layer that is co-existent with a section of the perimeter of the aperture and extends from the aperture;
bonding the metalized layers to one another such that the apertures are not aligned with one another, and such that the metalized layers form a conductive pathway between the apertures.
1 Assignment
0 Petitions
Accused Products
Abstract
A feed through for an active implantable medical device (AIMD). The feed through comprises first and second substantially planar, electrically non-conductive and fluid impermeable substrates usable for semiconductor device fabrication, each comprising: an aperture there through, and a contiguous metalized layer on the substrate surface that is co-existent with a section of the perimeter of the aperture and extends from the aperture; and a bond layer affixing the metalized layers of the first and second substrates to one another such that the apertures are not aligned with one another, and such that the metalized regions form a conductive pathway between the apertures.
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Citations
32 Claims
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1. A method for manufacturing a feed through for an implantable medical device, comprising:
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forming an aperture through each of first and second substantially planar, electrically non-conductive and fluid impermeable substrates usable for semiconductor fabrication; metalizing a region of a surface of the first substrate to form a contiguous metalized layer that is co-existent with a section of the perimeter of the aperture and extends from the aperture; metalizing a region of a surface of the second substrate to form a contiguous metalized layer that is co-existent with a section of the perimeter of the aperture and extends from the aperture; bonding the metalized layers to one another such that the apertures are not aligned with one another, and such that the metalized layers form a conductive pathway between the apertures. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A feed through for an implantable medical device, comprising:
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first and second substantially planar, electrically non-conductive and fluid impermeable substrates usable for semiconductor device fabrication, each comprising; an aperture there through, and a contiguous metalized layer on the substrate surface that is co-existent with a section of the perimeter of the aperture and extends from the aperture; and a bond layer affixing the metalized layers of the first and second substrates to one another such that the apertures are not aligned with one another, and such that the metalized regions form a conductive pathway between the apertures. - View Dependent Claims (11, 12, 13, 14, 15, 16)
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17. A method for manufacturing a feed through for an implantable medical device, comprising:
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forming an aperture through each of first and second substantially planar, electrically non-conductive and fluid impermeable substrates usable for semiconductor device fabrication; metalizing a region of a surface of the first substrate to form a contiguous metalized layer that is co-existent with a section of the perimeter of the aperture and extends from the aperture; metalizing a region of a surface of the second substrate to form a contiguous metalized layer that is co-existent with a section of the perimeter of the aperture and extends from the aperture; and bonding the metalized layers to opposing surfaces of a third substantially planar, electrically non-conductive and fluid impermeable substrate usable for semiconductor device fabrication, having at least one conductive region disposed there through that forms a conductive pathway between the metalized layers. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24)
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25. A feed through for an implantable medical device, comprising:
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first and second substantially planar, electrically non-conductive and fluid impermeable substrates usable for semiconductor device fabrication, each comprising; an aperture there through, and a contiguous metalized layer on the substrate surface that is co-existent with a section of the perimeter of the aperture and extends from the aperture; and a third substantially planar, electrically non-conductive and fluid impermeable substrate usable for semiconductor device fabrication, having at least one conductive region extending there through; and first and second bond layers affixing the metalized layers of the first and second substrates to opposing surfaces of a third substrate such that the conductive region provides a conductive pathway between the metalized layers. - View Dependent Claims (26, 27, 28, 29, 30, 31, 32)
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Specification