SEMICONDUCTOR LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD OF THE SAME

• US 20100258830A1
• Filed: 11/13/2008
• Published: 10/14/2010
• Est. Priority Date: 11/19/2007
• Status: Active Grant

• Current Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Inventors: Nakahara, Koichi, Shirahata, Takahiro, Ide, Yoshiyuki, Kitazono, Toshirou, Nakatsu, Kouji, Yonekura, Isamu, Kamei, Hidenori, Tooya, Yoshirou, Koya, Kenichi, Obara, Kunihiko, Maeda, Toshihide
• Granted Patent: US 8,552,444 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/05111 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/05155 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/05169 Platinum [Pt] as principal constituent
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/0558 being stacked
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05639 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/05666 Titanium [Ti] as principal constituent
• CPC Class Codes: H01L 2224/13 of an individual bump connector
• CPC Class Codes: H01L 2224/14 of a plurality of bump connectors
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12035 : Zener diode
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 33/54 : having a particular shape
• CPC Class Codes: H01L 33/60 : Reflective elements

Abstract

Light from a semiconductor light-emitting element travels in all directions. Thus, light that travels in the directions other than a lighting direction cannot be used effectively. Means for forming a semiconductor light-emitting element having tilted side surfaces, and forming a reflective layer on the tilted side surfaces has been proposed. However, since the tilted surfaces are formed by an etching method or the like, it takes a long time to form the tilted surfaces, and it is difficult to control the tilted surfaces. As a solution to these problems, semiconductor light-emitting elements are placed on a submount substrate and sealed with a sealant, and then a groove is formed in a portion between adjoining ones of the semiconductor light-emitting elements. The grooves formed are filled with a reflective material, and a light-emitting surface is polished. Then, the submount substrate is divided into individual semiconductor light-emitting devices. Thus, a semiconductor light-emitting device having a reflective layer on its side surfaces can be obtained.

Claims

1. A semiconductor light-emitting device, comprising:

a semiconductor light-emitting element;

a submount for placing the semiconductor light-emitting element thereon;

a sealant for sealing the semiconductor light-emitting element over the submount; and

a reflective layer provided on a side surface of the sealant, provided that a light-emitting surface of the sealant is an upper surface.

2. The semiconductor light-emitting device of claim 1, wherein

the sealant has a flat surface as the light-emitting surface.

3. The semiconductor light-emitting device of claim 2, wherein

the reflective layer is flush with the light-emitting surface, and is in contact with both the sealant and the submount.

4. The semiconductor light-emitting device of claim 1, wherein

a boundary surface between the sealant and the reflective layer is substantially perpendicular to a surface of the submount.

5. The semiconductor light-emitting device of claim 1, wherein

a boundary surface between the sealant and the reflective layer is at an obtuse angle to a surface of the submount.

6. The semiconductor light-emitting device of claim 1, further comprising:

a fine concavo-convex structure provided on the light-emitting surface.

7. The semiconductor light-emitting device of claim 1, further comprising:

a phosphor layer formed around the semiconductor light-emitting element.

8. A method for manufacturing a semiconductor light-emitting device, comprising the steps of:

fixing a plurality of semiconductor light-emitting elements to a submount substrate;

sealing the semiconductor light-emitting elements with a sealant;

filling a portion between the semiconductor light-emitting elements with a reflective material;

polishing a surface of the sealant; and

cutting the submount substrate along the portion filled with the reflecting material.

9. The method of claim 8, wherein

the step of sealing the semiconductor light-emitting elements with the sealant is a step of individually sealing the semiconductor light-emitting elements placed on the submount substrate.

10. The method of claim 8, wherein

the step of sealing the semiconductor light-emitting elements with the sealant is a step of forming a layer of the sealant over the submount substrate.

11. The method of claim 8, wherein

the step of filling the portion between the semiconductor light-emitting elements with the reflective material includes the steps of

forming in the portion between the semiconductor light-emitting elements a groove that extends to a depth in the submount substrate, and

filling the groove with the reflecting material.

12. The method of claim 11, wherein

the groove is formed substantially perpendicularly to a surface of the submount substrate.

13. The method of claim 11, wherein

the groove is formed obliquely to a surface of the submount substrate.

14. The method of claim 8, further comprising the step of:

forming a fine concavo-convex structure after the step of polishing the surface of the sealant.

15. The method of claim 8, further comprising the step of:

forming a phosphor layer around each of the semiconductor light-emitting elements.