Method for attaching a first carrier device to a second carrier device and micromechanical components
First Claim
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1. A method for attaching a first carrier device to a second carrier device, comprising:
- forming at least one of a first bond layer and a first solder layer on a first exterior of the first carrier device, wherein the at least one of the first bond layer and the first solder layer includes a first cover area at least partially covering the first exterior of the first carrier device, and wherein a partial surface of the first exterior of the first carrier device is framed by the at least one of the first bond layer and the first solder layer;
placing the first carrier device having the at least one of the first bond layer and the first solder layer on the second carrier device in such a way that a first contact area of the at least one of the first bond layer and the first solder layer contacts a second contact area of the second carrier device; and
one of fixedly bonding or fixedly soldering the first carrier device to the second carrier device;
wherein the at least one of the first bond layer and the first solder layer is formed in such a way that the first cover area is shaped larger than the first contact area.
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Abstract
A method for attaching a first carrier device to a second carrier device includes forming at least one first bond layer and/or solder layer on a first exterior of the first carrier device, a partial surface being framed by the at least one first bond layer and/or solder layer, and placing the first carrier device on the second carrier device and fixedly bonding or soldering the first carrier device to the second carrier device. The at least one first bond layer and/or solder layer includes a first cover area which is larger than a first contact area.
8 Citations
11 Claims
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1. A method for attaching a first carrier device to a second carrier device, comprising:
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forming at least one of a first bond layer and a first solder layer on a first exterior of the first carrier device, wherein the at least one of the first bond layer and the first solder layer includes a first cover area at least partially covering the first exterior of the first carrier device, and wherein a partial surface of the first exterior of the first carrier device is framed by the at least one of the first bond layer and the first solder layer; placing the first carrier device having the at least one of the first bond layer and the first solder layer on the second carrier device in such a way that a first contact area of the at least one of the first bond layer and the first solder layer contacts a second contact area of the second carrier device; and one of fixedly bonding or fixedly soldering the first carrier device to the second carrier device; wherein the at least one of the first bond layer and the first solder layer is formed in such a way that the first cover area is shaped larger than the first contact area. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method for attaching a first carrier device to a second carrier device, comprising:
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forming at least one of a first bond layer and a first solder layer on a first exterior of the first carrier device, wherein a partial surface of the first exterior of the first carrier device is framed by the at least one of the first bond layer and the first solder layer; placing the first carrier device having the at least one of the first bond layer and the first solder layer on the second carrier device in such a way that a first contact area of the at least one of the first bond layer and the first solder layer contacts a second contact area of the second carrier device; and one of fixedly bonding or fixedly soldering the first carrier device to the second carrier device; wherein before placing the first carrier device on the second carrier device, at least one of bond-temperature-resistant flow-protection surface unevenness and solder-temperature-resistant flow-protection surface unevenness is formed on at least one of the first exterior and the second exterior, and wherein the at least one of the bond-temperature-resistant flow-protection surface unevenness and the solder-temperature-resistant flow-protection surface unevenness frames the partial surface of the first exterior of the first carrier device after the first carrier device is placed on the second carrier device. - View Dependent Claims (8)
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9. A micromechanical component, comprising:
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a first carrier device; and a second carrier device attached to the first carrier device by at least one of a bond-joining layer and a solder-joining layer; wherein the at least one of the bond-joining layer and the solder-joining layer covers an exterior of the first carrier device in such a way that the at least one of the bond-joining layer and the solder-joining layer frames a partial surface of the exterior of the first carrier device, and wherein at least one of the first carrier device and the second carrier device has at least one surface unevenness covered by the at least one of the bond-joining layer and the solder-joining layer. - View Dependent Claims (10)
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11. The micromechanical component, comprising:
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a first carrier device; and a second carrier device attached to the first carrier device by at least one of a bond-joining layer and a solder-joining layer; wherein the at least one of the bond-joining layer and the solder-joining layer covers an exterior of the first carrier device in such a way that the at least one of the bond-joining layer and the solder-joining layer frames a partial surface of the exterior of the first carrier device, and wherein at least one of bond-temperature-resistant flow-protection surface unevenness and solder-temperature-resistant flow-protection surface unevenness frames the partial surface of the exterior of the first carrier device.
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Specification