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Method for attaching a first carrier device to a second carrier device and micromechanical components

  • US 20100258884A1
  • Filed: 04/12/2010
  • Published: 10/14/2010
  • Est. Priority Date: 04/14/2009
  • Status: Active Grant
First Claim
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1. A method for attaching a first carrier device to a second carrier device, comprising:

  • forming at least one of a first bond layer and a first solder layer on a first exterior of the first carrier device, wherein the at least one of the first bond layer and the first solder layer includes a first cover area at least partially covering the first exterior of the first carrier device, and wherein a partial surface of the first exterior of the first carrier device is framed by the at least one of the first bond layer and the first solder layer;

    placing the first carrier device having the at least one of the first bond layer and the first solder layer on the second carrier device in such a way that a first contact area of the at least one of the first bond layer and the first solder layer contacts a second contact area of the second carrier device; and

    one of fixedly bonding or fixedly soldering the first carrier device to the second carrier device;

    wherein the at least one of the first bond layer and the first solder layer is formed in such a way that the first cover area is shaped larger than the first contact area.

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