PRE-MOLDED CLIP STRUCTURE
6 Assignments
0 Petitions
Accused Products
Abstract
A method for making a premolded clip structure is disclosed. The method includes obtaining a first clip and a second clip, and forming a molding material around the first clip comprising a first surface and the second clip comprising a second surface. The first surface of the first clip structure and the second surface of the second clip structure are exposed through the molding material, and a premolded clip structure is then formed.
-
Citations
40 Claims
-
1-20. -20. (canceled)
-
21. A method comprising:
-
obtaining a first clip; and forming a molding material around the first clip comprising a first surface, wherein the first surface of the first clip is exposed through the molding material, and wherein a premolded clip structure is thereafter formed. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30)
-
-
31. A premolded clip structure comprising:
-
a first clip comprising a first surface; and a molding material coupled to the first clip, wherein the first surface is exposed through the molding material. - View Dependent Claims (32)
-
-
33. A semiconductor die package comprising:
-
a premolded clip structure comprising a first clip comprising a first surface, wherein the first surface is exposed through the molding material; and a semiconductor die comprising a first die surface and a second die surface, and a first electrical terminal and a second electrical terminal at the first die surface, wherein the first surface is electrically coupled to the first electrical terminal. - View Dependent Claims (34, 35, 36, 37, 38, 39, 40)
-
Specification