PACKAGE WITH SEMICONDUCTOR DEVICE AND INTEGRATED CIRCUIT MOUNTED THEREIN AND METHOD FOR MANUFACTURING SUCH PACKAGE
First Claim
1. A package with a semiconductor device and an integrated circuit mounted therein comprising:
- a first chip having a first base with the semiconductor device mounted on one side of the first base, a first electrical connection unit, a first bonding ring surrounding the semiconductor device, a first insulating layer formed on the other side of the first base and a first external bonding portion formed on the first insulating layer under a condition that the first external bonding portion is electrically connected to the first electrical connection unit; and
a second chip coupled to the first chip and comprising the integrated circuit corresponding to the semiconductor device, a second electrical connection unit fusing with the first electrical connection unit, and a second bonding ring fusing with the first bonding ring in order to form a hermetic cavity surrounding the semiconductor device, the integrated circuit, the first electrical connection unit and the second electrical connection unit.
1 Assignment
0 Petitions
Accused Products
Abstract
A multichip package includes a first chip and a second chip coupled with the first chip. The first chip includes a first base with a semiconductor device mounted on one side of the first base, a first electrical connection unit, a first bonding ring surrounding the semiconductor device, a first insulating layer formed on the other side of the first base and a first external bonding portion formed on the first insulating layer. The first external bonding portion is electrically connected to the first electrical connection unit. The second chip includes an integrated circuit corresponding to the semiconductor device, a second electrical connection unit fusing with the first electrical connection unit, and a second bonding ring fusing with the first bonding ring in order to form a hermetic cavity surrounding the semiconductor device, the integrated circuit, the first electrical connection unit and the second electrical connection unit.
-
Citations
20 Claims
-
1. A package with a semiconductor device and an integrated circuit mounted therein comprising:
-
a first chip having a first base with the semiconductor device mounted on one side of the first base, a first electrical connection unit, a first bonding ring surrounding the semiconductor device, a first insulating layer formed on the other side of the first base and a first external bonding portion formed on the first insulating layer under a condition that the first external bonding portion is electrically connected to the first electrical connection unit; and a second chip coupled to the first chip and comprising the integrated circuit corresponding to the semiconductor device, a second electrical connection unit fusing with the first electrical connection unit, and a second bonding ring fusing with the first bonding ring in order to form a hermetic cavity surrounding the semiconductor device, the integrated circuit, the first electrical connection unit and the second electrical connection unit. - View Dependent Claims (2, 3, 4, 5, 6, 7)
-
-
8. A package with a semiconductor device and an integrated circuit mounted therein comprising:
-
a first chip having the semiconductor device, a first electrical connection unit and a first bonding ring surrounding the semiconductor device; and a second chip coupled to the first chip and comprising a second base with the integrated circuit mounted on one side of the second base, a second electrical connection unit and a second bonding ring, the integrated circuit being opposite to and corresponding to the semiconductor device, the first and the second electrical connection units being fused with each other, similarly, the second bonding ring fusing with the first bonding ring in order to form a hermetic cavity surrounding the semiconductor device, the integrated circuit, the first electrical connection unit and the second electrical connection unit;
wherein the second chip further comprises a second insulating layer formed on the other side of the second base and a second external bonding portion disposed on the second insulating layer under a condition that the second external bonding portion is electrically connected to the second electrical connection unit. - View Dependent Claims (9, 10, 11, 12, 13)
-
-
14. A method for manufacturing a package comprising steps of:
-
a) providing a first wafer and a second wafer, the first wafer being provided with a first base, a semiconductor device mounted on one side of the first base, a first bonding pad and a first bonding ring enclosing the semiconductor device;
the second wafer being provided with a second base, an integrated circuit mounted on one side of the second base, a second bonding pad and a second bonding ring enclosing the integrated circuit;b) coupling the first and the second wafers with each other under a condition that the first and the second bonding pads are electrically connected with each other, and the first and the second bonding rings fuse with each other to jointly form a hermetic cavity which surrounds the semiconductor device, the integrated circuit, the first bonding pad and the second bonding pad; c) defining a first through hole on the other side of the first base with the first through hole reaching the first bonding pad;
or defining a second through hole on the other side of the second base with the second through hole reaching the second bonding pad;d) depositing a first insulating layer on the other side of the first base and then etching undesired portions of the first insulating layer to expose the first bonding pad through the first through hole;
or depositing a second insulating layer on the other side of the second base and then etching undesired portions of the second insulating layer to expose the second bonding pad through the second through hole;e) forming a first external bonding portion on the first insulating layer under a condition that the first external bonding portion is electrically connected to the first bonding pad for electrically connecting to an external circuit;
or forming a second external bonding portion on the second insulating layer under a condition that the second external bonding portion is electrically connected to the second bonding pad for electrically connecting to an external circuit; andf) cutting out the first and the second wafers simultaneously to obtain each independent package. - View Dependent Claims (15, 16, 17, 18, 19, 20)
-
Specification