Cooling Device, Cooling Arrangement and Lithographic Apparatus Comprising a Cooling Arrangement

• US 20100259734A1
• Filed: 03/30/2010
• Published: 10/14/2010
• Est. Priority Date: 04/13/2009
• Status: Active Grant

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Turk, Raymond, Kooiker, Allard Eelco, Boonen, Nico Antonius Johannes Hubertus, KNARREN, Bastiaan Andreas Wilhelmus Hubertus
• Granted Patent: US 8,817,228 B2
• Time in Patent Office: Days
• US Class Current: 355/30
• CPC Class Codes: G03B 27/52 Details
• CPC Class Codes: G03F 7/70825 Mounting of individual elements, e.g. mounts, holders or supports workpiece or mask holders G03F7/707
• CPC Class Codes: G03F 7/7085 Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
• CPC Class Codes: G03F 7/70858 Environment aspects, e.g. pressure of beam-path gas, temperature pollution aspects G03F7/70916
• CPC Class Codes: H01L 21/67109 mainly by convection
• CPC Class Codes: Y10T 29/49826 Assembling or joining

Abstract

A cooling arrangement is described and includes a heat sink having a first thermal contact surface, an object having a second thermal contact surface and a resilient wall. The first thermal contact surface and the second thermal contact surface face each other and define a gap. The resilient wall is part of an enclosure that surrounds a space at least comprising the gap, and the cooling arrangement includes a facility to maintain a pressure difference between the space and an environment of the cooling arrangement. Additionally, a lithographic apparatus comprising such a cooling arrangement is described.

Claims

1. A cooling arrangement comprising

(a) a heat sink having a first thermal contact surface,

(b) an object having a second thermal contact surface, and

(c) a resilient wall,

wherein the first thermal contact surface and the second thermal contact surface face each other and define a gap, wherein the resilient wall is part of an enclosure that surrounds a space at least comprising the gap, and wherein the cooling arrangement comprises a facility to maintain a pressure difference between said space and an environment of the cooling arrangement.

2. A cooling arrangement according to claim 1, wherein the enclosed space is filled with a gas.

3. A cooling arrangement according to claim 1, comprising a facility for providing a gas into the enclosed space.

4. A cooling arrangement according to claim 1, wherein the resilient wall is a bellows.

5. A cooling arrangement according to claim 1, wherein the resilient wall surrounds the heat sink.

6. A cooling arrangement according to claim 4, wherein the resilient wall surrounds the heat sink.

7. A cooling arrangement according to claim 1, wherein the resilient wall has a first end that is assembled with at least one of the object and the heat sink, and a second end that is provided with a sealing ring that is pressed by a tension in the resilient wall to the other one of the object and the heat sink.

8. A cooling arrangement according to claim 7, wherein the resilient wall is a bellows.

9. A cooling arrangement according to claim 7, wherein the sealing ring is provided with an opening.

10. A cooling arrangement according to claim 8, wherein the opening is formed by at least one groove at a side of the sealing ring facing towards said other one of the object and the heat sink.

11. A cooling arrangement according to claim 1, comprising a detector module as the object to be cooled.

12. A cooling arrangement according to claim 7, comprising a detector module as the object to be cooled.

13. A lithographic apparatus comprising:

(a) an EUV source,

(b) a vacuum chamber having arranged therein

(i) an imaging system configured to direct electromagnetic radiation from the source at an object plane so as to illuminate the object plane;

(ii) a first grating positioned in the object plane;

(iii) a projection optical system configured to project an image of the first grating onto a focal plane; and

(c) a cooling arrangement comprising

(i) a heat sink having a first thermal contact surface,

(ii) a detector module having a second thermal contact surface, and

(iii) a resilient wall,

(1) wherein the first thermal contact surface and the second thermal contact surface face each other and define a gap, wherein the resilient wall is part of an enclosure that surrounds a space at least comprising the gap, and wherein the cooling arrangement comprises a facility to maintain a pressure difference between said space and an environment of the cooling arrangement, and

(2) wherein the detector module is configured to receive the image projected by the projection optical system.

14-15. -15. (canceled)

16. A method of providing a cooling arrangement, the method comprising:

(a) providing a heat sink having a first thermal contact surface;

(b) providing an object having a second thermal contact surface; and

(c) providing a resilient wall,

wherein the first thermal contact surface and the second thermal contact surface face each other and define a gap, wherein the resilient wall is part of an enclosure that surrounds a space at least comprising the gap, and wherein the cooling arrangement comprises a facility to maintain a pressure difference between the space and an environment of the cooling arrangement.

17. (canceled)

18. A method of measuring a wavefront, the method comprising:

(a) directing electromagnetic radiation from a source to an object plane so as to illuminate the object plane;

(b) projecting an image of a first grating positioned in the object plane onto a focal plane at a detector module; and

(c) cooling the detector module using a heat sink and a resilient wall such that a first thermal contact surface of the heat sink and a second thermal contact surface of the detector module face each other and define a gap, wherein the resilient wall is part of an enclosure that surrounds a space at least comprising the gap, and wherein a pressure difference is maintained between the space and an environment external to the resilient wall.