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Cooling Device, Cooling Arrangement and Lithographic Apparatus Comprising a Cooling Arrangement

  • US 20100259734A1
  • Filed: 03/30/2010
  • Published: 10/14/2010
  • Est. Priority Date: 04/13/2009
  • Status: Active Grant
First Claim
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1. A cooling arrangement comprising(a) a heat sink having a first thermal contact surface,(b) an object having a second thermal contact surface, and(c) a resilient wall,wherein the first thermal contact surface and the second thermal contact surface face each other and define a gap, wherein the resilient wall is part of an enclosure that surrounds a space at least comprising the gap, and wherein the cooling arrangement comprises a facility to maintain a pressure difference between said space and an environment of the cooling arrangement.

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