LIGHT EMITTING APPARATUS

• US 20100259920A1
• Filed: 04/05/2010
• Published: 10/14/2010
• Est. Priority Date: 04/08/2009
• Status: Abandoned Application

• Current Assignee: Aussmak Optoelectronics Corp.
• Original Assignee: Aussmak Optoelectronics Corp.
• Inventors: LIN, CHUNG-JYH
• Application Number:
  US12/754,600
• Publication Number:
  US 20100259920A1
• Time in Patent Office: Days
• US Class Current: 362/97.100
• CPC Class Codes: F21S 4/28 rigid, e.g. LED bars
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding

Abstract

A light emitting apparatus includes at least one first substrate, a plurality of light emitting units and a partition structure. The light emitting units are disposed in two-dimension array on the first substrate. Each light emitting unit has at least one light emitting diode (LED) die. The LED die is disposed on the first substrate by wire bonding or flip-chip bonding. The partition structure is disposed correspondingly around each light emitting unit.

Claims

1. A light emitting apparatus, comprising:

at least a first substrate;

a plurality of light emitting units disposed in two-dimension array on the first substrate, wherein each of the light emitting units has at least a light emitting diode (LED) die disposed on the first substrate by wire bonding or flip-chip bonding; and

a partition structure disposed around each of the light emitting units correspondingly.

2. The light emitting apparatus as recited in claim 1, which is a display apparatus, a lighting apparatus, a backlight module or a light bar.

3. The light emitting apparatus as recited in claim 1, wherein the partition structures corresponding to two adjacent light emitting units are spaced with a gap or connected together.

4. The light emitting apparatus as recited in claim 1, wherein the partition structure is disposed on the first substrate.

5. The light emitting apparatus as recited in claim 1, wherein the partition structure is disposed around each of the light emitting units continuously or discretely.

6. The light emitting apparatus as recited in claim 1, wherein the total length of the partition structure is larger than triple of a shortest distance from the partition structure to the central position of the corresponding light emitting unit.

7. The light emitting apparatus as recited in claim 1, further comprising:

a second substrate disposed opposite to the first substrate.

8. The light emitting apparatus as recited in claim 7, wherein the second substrate has a shielding layer having a plurality of openings corresponding to the light emitting units respectively.

9. The light emitting apparatus as recited in claim 7, further comprising:

a conductive element disposed between the first substrate and the second substrate and electrically connected with the first substrate and the second substrate.

10. The light emitting apparatus as recited in claim 1, wherein the material of the partition structure includes metal, alloy, polymer, plastics, ceramics or glass.

11. The light emitting apparatus as recited in claim 1, wherein the first substrate has a shielding layer disposed at the same side as the LED dies on the first substrate and having a plurality of openings corresponding to the light emitting units respectively.

12. The light emitting apparatus as recited in claim 1, wherein the first substrate has a circuit layer electrically connected with the LED dies.

13. The light emitting apparatus as recited in claim 12, wherein the first substrate further has a patterned layer and the partition layer is disposed on the patterned layer.

14. The light emitting apparatus as recited in claim 13, wherein the material of the patterned layer includes copper.

15. The light emitting apparatus as recited in claim 1, wherein a height of the partition structure is greater than that of the LED die.

16. A light emitting apparatus, comprising:

at least a first substrate having a substrate body and a patterned layer disposed on the substrate body;

a plurality of light emitting units disposed in two-dimension array on the first substrate, wherein each of the light emitting units has at least an LED die; and

a partition structure disposed around each of the light emitting units and aligned with the patterned layer, wherein adhesion between the partition structure and the patterned layer is greater than that between the partition structure and the substrate body.

17. The light emitting apparatus as recited in claim 16, wherein the partition structures corresponding to two adjacent light emitting units are spaced with a gap or connected together.

18. The light emitting apparatus as recited in claim 16, wherein the partition structure is disposed around each of the light emitting units continuously or discretely.

19. The light emitting apparatus as recited in claim 16, wherein the total length of the partition structure is larger than triple of a shortest distance from the partition structure to the central position of the corresponding light emitting unit.

20. The light emitting apparatus as recited in claim 16, wherein the material of the partition structure includes metal, alloy, polymer, plastics, ceramics or glass.