Method for Electrochemical Fabrication

• US 20100264037A1
• Filed: 05/28/2010
• Published: 10/21/2010
• Est. Priority Date: 04/04/1997
• Status: Abandoned Application

• Current Assignee: University of Southern California
• Original Assignee: University of Southern California
• Inventors: Cohen, Adam L.
• Application Number:
  US12/789,704
• Publication Number:
  US 20100264037A1
• Time in Patent Office: Days
• US Class Current: 205/131
• CPC Class Codes: B33Y 10/00 Processes of additive manufacturing
• CPC Class Codes: B81C 1/00126 Static structures not provided for in groups B81C1/00031 - B81C1/00119
• CPC Class Codes: B81C 2201/0181 Physical Vapour Deposition [PVD], i.e. evaporation, sputtering, ion plating or plasma assisted deposition, ion cluster beam technology
• CPC Class Codes: B81C 2201/0197 Processes for making multi-layered devices not provided for in groups B81C2201/0176 - B81C2201/0192
• CPC Class Codes: B81C 2201/032 LIGA process
• CPC Class Codes: C25D 1/00 Electroforming
• CPC Class Codes: C25D 1/003 3D structures, e.g. superposed patterned layers
• CPC Class Codes: C25D 17/06 Suspending or supporting devices for articles to be coated
• CPC Class Codes: C25D 5/022 using masking means
• CPC Class Codes: C25D 5/10 Electroplating with more than one layer of the same or of different metals for bearings C25D7/10
• CPC Class Codes: C25D 5/12 at least one layer being of nickel or chromium
• CPC Class Codes: C25D 5/22 Electroplating combined with mechanical treatment during the deposition
• CPC Class Codes: C25D 5/611 Smooth layers
• CPC Class Codes: H01L 21/2885 using an external electrical current, i.e. electro-deposition
• CPC Class Codes: H05K 3/241 characterised by the electroplating method; means therefor, e.g. baths or apparatus
• CPC Class Codes: Y10T 428/12486 Laterally noncoextensive components [e.g., embedded, etc.]
• CPC Class Codes: Y10T 428/239 Complete cover or casing

Abstract

An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

Claims

1. An electroplating method for fabricating a multi-layer three-dimensional structure, comprising:

(i) forming a first layer comprising depositing a first structural material and a first sacrificial material and planarizing the deposited first structural material and first sacrificial material to set a boundary level of the first layer; and

(ii) forming additional layers with an initial additional layer formed on and adhered to the first layer and with subsequent additional layers formed on and adhered to previously formed additional layers, wherein the forming of each additional layer comprises depositing an additional structural material and depositing an additional sacrificial material and planarizing of the deposited additional structural material and additional sacrificial material to set a boundary level for each additional layer;

wherein after formation of a plurality of the additional layers, performing the following steps in order;

(a) etching away a volume of sacrificial material to form a void within a multi-layer cavity defined by structural material;

(b) depositing a secondary structural material into the void within the cavity.

2. The method of claim 1 wherein the deposition of the sacrificial material on a given additional layer occurs selectively via a mask placed in contact with a previously formed layer.

3. The method of claim 2 wherein the deposition of the structural material for the given additional layer occurs via a blanket deposition.

4. The method of claim 1 wherein the additional structural material for at least a portion of the additional layers comprises a metal and the additional sacrificial material for at least a portion of the additional layers comprises a metal.

5. The method of claim 4 wherein the secondary structural material comprises a powder material.

6. The method of claim 5 wherein powder material comprises a magnetic material.

7. The method of claim 6 wherein after deposition of the powder material, the powder material is sintered.

8. The method of claim 1 wherein after deposition of the powder material, one or more further layers are formed with each comprising a further deposited structural material and a further deposited sacrificial material.