LED PACKAGE STRUCTURE

• US 20100264439A1
• Filed: 02/25/2010
• Published: 10/21/2010
• Est. Priority Date: 04/20/2009
• Status: Abandoned Application

• Current Assignee: Power Data Communication Company Limited
• Original Assignee: Power Data Communication Company Limited
• Inventors: CHEN, Yi-Sheng, CHEN, Chien-Yuan
• Application Number:
  US12/712,536
• Publication Number:
  US 20100264439A1
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/58 Optical field-shaping elements

Abstract

A light emitting diode (LED) package structure includes a substrate having a chip disposal area and a recession, a chip installed in the chip disposal area, a silicon connecting element installed at the recession, and a silicon lens disposed at a position corresponding to the recession and coupled to the silicon connecting element, such that the silicon connecting element in the recession can assure the silicon lens to be secured onto the substrate to prevent the silicon lens from falling out.

Claims

1. A light emitting diode (LED) package structure, comprising:

a substrate, having a chip disposal area disposed on the substrate, and a recession disposed around the chip disposal area;

a chip, coupled to the chip disposal area;

a silicon connecting element, filled into the recession; and

a silicon lens, installed at a position corresponding to the recession, and coupled to the silicon connecting element, for packaging the chip.

2. The LED package structure of claim 1, wherein the recession has a cross-sectional shape selected from the collection of a rectangular shape, a trapeze shape, a V-shape, a semicircular shape, a dove-tail shape and a triangular shape.

3. The LED package structure of claim 1, wherein the silicon lens has a thickness smaller than a cross-sectional width of the recession.

4. The LED package structure of claim 1, wherein the substrate is one selected from the collection of a silicon substrate, a low-temperature cofired ceramics (LTCC) substrate, an aluminum substrate, a copper substrate, a printed circuit board, and a flexible substrate.

5. The LED package structure of claim 1, wherein the silicon connecting element is a silicone layer.

6. The LED package structure of claim 1, wherein the silicon connecting element has a cross-sectional shape corresponding to the cross-sectional shape of the recession.

7. The LED package structure of claim 1, wherein the silicon connecting element has a cross-sectional shape different from the cross-sectional shape of the recession.

8. The LED package structure of claim 1, wherein the silicon lens comprises a first silicon layer, a second silicon layer, and a phosphor layer.