DEVICE FOR EMITTING WHITE-COLOR LIGHT

• US 20100264841A1
• Filed: 07/01/2010
• Published: 10/21/2010
• Est. Priority Date: 07/29/1996
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Nichia Corporation
• Inventors: Shimizu, Yoshinori, Moriguchi, Toshio, Sakano, Kensho, Noguchi, Yasunobu
• Granted Patent: US 7,855,092 B2
• Time in Patent Office: Days
• US Class Current: 315/287
• CPC Class Codes: C09K 11/7767 Chalcogenides
• CPC Class Codes: C09K 11/7774 Aluminates
• CPC Class Codes: G02B 6/0023 provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
• CPC Class Codes: G02B 6/0025 Diffusing sheet or layer; Prismatic sheet or layer
• CPC Class Codes: G02B 6/0051 Diffusing sheet or layer
• CPC Class Codes: G02B 6/0073 Light emitting diode [LED]
• CPC Class Codes: H01J 29/20 characterised by the luminescent material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/45169 Platinum (Pt) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01021 : Scandium [Sc]
• CPC Class Codes: H01L 2924/01067 : Holmium [Ho]
• CPC Class Codes: H01L 2924/01068 : Erbium [Er]
• CPC Class Codes: H01L 2924/12036 : PN diode
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/15747 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/20751 : larger or equal to 10 microns less than 20 microns
• CPC Class Codes: H01L 2924/20752 : larger or equal to 20 microns less than 30 microns
• CPC Class Codes: H01L 2924/20753 : larger or equal to 30 microns less than 40 microns
• CPC Class Codes: H01L 2924/20754 : larger or equal to 40 microns less than 50 microns
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01L 2933/0091 : Scattering means in or on the semiconductor body or semiconductor body package H01L33/22 takes precedence
• CPC Class Codes: H01L 33/50 : Wavelength conversion elements
• CPC Class Codes: H01L 33/501 : characterised by the materials, e.g. binder
• CPC Class Codes: H01L 33/502 : Wavelength conversion materials
• CPC Class Codes: H01L 33/504 : Elements with two or more wavelength conversion materials
• CPC Class Codes: H01L 33/56 : Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H05B 33/14 : characterised by the chemical or physical composition or the arrangement of the electroluminescent material , or by the simultaneous addition of the electroluminescent material in or onto the light source
• CPC Class Codes: Y02B 20/00 : Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps

Abstract

A device for emitting white-color light comprises: a light emitting diode including: an LED chip comprising a gallium nitride compound semiconductor containing indium and being capable of emitting a blue color light, and a phosphor capable of absorbing a part of the blue color light and emitting a light having longer wavelength than the blue color light, the blue color light and the light from the phosphor being mixed to make the white-color; a control unit for converting an input to pulse signals; and a driver receiving the pulse signals from the control unit to drive the LED chip, wherein the brightness of the white-color light from the light emitting diode is controlled by a width of the pulse signals.

Claims

1. A device for emitting white-color light comprising:

(i) a light emitting diode including;

an LED chip comprising a gallium nitride compound semiconductor containing indium and being capable of emitting a blue color light, and

a phosphor capable of absorbing a part of the blue color light and emitting a light having longer wavelength than the blue color light,

the blue color light and the light from said phosphor being mixed to make the white-color,

(ii) a control unit for converting an input to pulse signals,

(iii) a driver receiving said pulse signals from said control unit to drive said LED chip,

wherein the brightness of the white-color light from said light emitting diode is controlled by a width of said pulse signals.

2. The device according to claim 1, wherein said device includes a data storage for storing the input.

3. The device according to claim 1, wherein said control unit includes a CPU.

4. The device according to claim 1, wherein said device is placed in an aluminum-containing chassis.

5. The device according to claim 4, wherein said chassis is diecast chassis.

6. The device according to claim 5, wherein said chassis is sealed by a rubber packing.

7. The device according to claim 1, wherein said light emitting diode is sealed with silicone.

8. The device according to claim 1, wherein said device comprises a dispersive member for dispersing light from said light emitting diode.

9. The device according to claim 1, wherein said device comprises a reflective member for reflecting light from said light emitting diode.

10. The device according to claim 1, wherein multiple light emitting diodes are arranged in a spiral configuration.

11. The device according to claim 1, wherein multiple light emitting diodes are arranged in a swirling configuration.

12. The device according to claim 1, wherein said phosphor has a garnet structure and is activated with cerium.

13. The device according to claim 1, wherein said phosphor comprises two or more kinds of phosphors of different emission wavelengths.

14. The device according to claim 5, wherein said light emitting diode is sealed with silicone.

15. The device according to claim 5, wherein said light emitting diode comprises a transparent material covering said LED chip and containing said phosphor, and wherein a concentration of said phosphor in the vicinity of said LED chip is larger than a concentration of said phosphor in the vicinity of the surface of said transparent material.

16. The device according to claim 6, wherein said light emitting diode comprises a transparent material covering said LED chip and containing said phosphor, and wherein a concentration of said phosphor in the vicinity of said LED chip is larger than a concentration of said phosphor in the vicinity of the surface of said transparent material.

17. The device according to claim 1, wherein said white-color light has incandescent-lamp-color.