Surface mount thin film fuse structure and method of manufacturing the same

• US 20100265031A1
• Filed: 04/22/2008
• Published: 10/21/2010
• Est. Priority Date: 12/21/2007
• Status: Abandoned Application

• Current Assignee: Chun-Chang Yen
• Original Assignee: Chun-Chang Yen
• Inventors: Yen, Chun-Chang
• Application Number:
  US12/081,869
• Publication Number:
  US 20100265031A1
• Time in Patent Office: Days
• US Class Current: 337/297
• CPC Class Codes: H01H 2085/0414 Surface mounted fuses
• CPC Class Codes: H01H 69/022 of printed circuit fuses
• CPC Class Codes: H01H 85/0047 Heating means
• CPC Class Codes: H01H 85/0411 Miniature fuses
• CPC Class Codes: Y10T 29/49107 Fuse making

Abstract

The present invention discloses a surface mount thin film fuse structure including a fusible fuse circuit structure disposed on a side of an insulating substrate, and the fusible fuse circuit structure has a fusible link portion electrically connected between two opposite electrode portions. If an overload current is passed through the fusible link portion, the fusible link portion will be melted down by a high temperature or a specific temperature to achieve the over current protection effect. At least one space is defined between the fusible link portion and the insulating substrate, such that a heat generated by the electrically energized the fusible link portion will not be dissipated through the heat conduction of the insulating substrate to achieve the circuit protection effect.

Claims

1. A surface mount thin film fuse structure, comprising:

an insulating substrate, having a fusible fuse circuit structure disposed on at least one surface of the insulating substrate, and the fusible fuse circuit structure comprising two opposite electrode portions and a fusible link portion, wherein the fusible link portion is connected to the two opposite electrode portions, and at least one space is defined between the fusible link portion and the insulating substrate;

a protective layer, having the fusible link portion disposed thereon.

2. The surface mount thin film fuse structure as claimed in claim 1, wherein the insulating substrate includes a fusible fuse circuit structure disposed separately on both opposite surfaces of the insulating substrate.

3. The surface mount thin film fuse structure as claimed in claim 2, wherein the fusible link portion has a tin layer disposed at the middle of a surface of the fusible link portion, and at least one other space is defined by the protective layer, the fusible link portion and the tin layer.

4. The surface mount thin film fuse structure as claimed in claim 2, wherein the insulating substrate further comprises a conducting portion disposed separately on both lateral sides of the insulating substrate for connecting the two opposite electrode portions.

5. The surface mount thin film fuse structure as claimed in claim 4, wherein the fusible link portion has a tin layer disposed at the middle of a surface of the fusible link portion, and at least one other space is defined by the protective layer, the fusible link portion and the tin layer.

6. The surface mount thin film fuse structure as claimed in claim 4, wherein the electrode portion and the conducting portion install a nickel layer and a tin layer on surfaces of the electrode portion and the conducting portion.

7. The surface mount thin film fuse structure as claimed in claim 1, wherein the fusible link portion has a tin layer disposed at the middle of a surface of the fusible link portion.

8. The surface mount thin film fuse structure as claimed in claim 7, further comprising at least one other space defined by the protective layer, the fusible link portion and the tin layer.

9. A method of manufacturing a surface mount thin film fuse structure, comprising the steps of:

(A) providing an insulating substrate;

(B) installing a spacer layer on at least one surface of the insulating substrate and the spacer layer locating at a desired position for installing the fusible link portion;

(C) installing a copper layer on a surface of the insulating substrate having the spacer layer and covering the whole surface of the insulating substrate with the copper layer;

(D) coating a photoresist on the copper layer, and performing exposure, development and etching processes to form a fusible fuse circuit structure by the copper layer, wherein the fusible fuse circuit structure comprises two opposite electrode portions and a fusible link portion connected to the two opposite electrode portions; and

(E) removing the spacer layer to define at least one space between the fusible link portion and the insulating substrate.

10. The method of manufacturing a surface mount thin film fuse structure as claimed in claim 9, wherein the Step B installs a spacer layer separately on both opposite surfaces of the insulating substrate.

11. The method of manufacturing a surface mount thin film fuse structure as claimed in claim 9, wherein the spacer layer is made of a photoresist material, and the Step E removes the spacer layer together with the photoresist remained on the fusible fuse circuit structure.

12. The method of manufacturing a surface mount thin film fuse structure as claimed in claim 11, wherein the Step E further comprises a step F for installing a tin layer at the middle of a surface of the fusible link portion, and the Step F further comprises a step G for installing a nickel layer and a tin layer sequentially on a surface of the electrode portion, and the Step G further comprises a Step H for installing a protective layer at a position of the fusible link portion of the fusible fuse circuit structure.

13. The method of manufacturing a surface mount thin film fuse structure as claimed in claim 12, wherein the Step F further installs a second spacer layer between the fusible link portion and the tin layer, and the second spacer layer is a hot melt material having a melting point lower than the melting point of the tin layer, and the Step H removes the second spacer layer by heating after installing a protective layer.

14. The method of manufacturing a surface mount thin film fuse structure as claimed in claim 12, wherein a Step I is included between the Steps F and G, and the Step I installs a conducting portion disposed separately on both lateral sides of the insulating substrate for connecting the two opposite electrode portions.

15. The method of manufacturing a surface mount thin film fuse structure as claimed in claim 9, wherein the spacer layer is made of a hot melt material, and the spacer layer has a melting point lower than the melting point of the tin layer, and the Step E removes the spacer layer by heating, and then removes the photoresist remained on the fusible fuse circuit structure by a chemical solvent.

16. The method of manufacturing a surface mount thin film fuse structure as claimed in claim 15, wherein a Step F is included between the Steps D and E, and the Step F installs a tin layer at the middle of a surface of the fusible link portion, and a Step G is carried out after the Step E, and the Step G installs a nickel layer and a tin layer sequentially on both sides of the electrode portion, and the Step G further includes a Step H for installing a protective layer disposed at a position of the fusible link portion of the fusible fuse circuit structure.

17. The method of manufacturing a surface mount thin film fuse structure as claimed in claim 16, wherein the Step F further installs a second spacer layer between the fusible link portion and the tin layer, and the second spacer layer is a hot melt material having a melting point lower than the melting point of tin layer, and the Step H removes the second spacer layer by heating after installing the protective layer.

18. The method of manufacturing a surface mount thin film fuse structure as claimed in claim 16, wherein a Step I is included between the Steps F and G, and the Step I installs a conducting portion disposed separately on both lateral sides of the insulating substrate for connecting the two opposite electrode portions.

19. The method of manufacturing a surface mount thin film fuse structure as claimed in claim 9, wherein the spacer layer is made of a water washable and durable material, and the Step E removes the spacer layer by a high pressure water, and then removes the photoresist remained on the fusible fuse circuit structure by a chemical solvent, and the Step E further includes a Step F for installing a tin layer at the middle of a surface of the fusible link portion, and the Step F further includes a Step G for installing a nickel layer and a tin layer sequentially on surfaces of the electrode portions, and a Step H is carried out after the Step G for installing a protective layer at a position of the fusible link portion of the fusible fuse circuit structure.

20. The method of manufacturing a surface mount thin film fuse structure as claimed in claim 19, wherein the Step F installs a second spacer layer between the fusible link portion and the tin layer, and the second spacer layer is a hot melt material having a melting point lower than the melting point of the tin layer, and the Step H removes the second spacer layer by heating after installing the protective layer, and a Step I is included between the Steps F and G for installing a conducting portion disposed separately on both lateral sides of the insulating substrate for connecting the two opposite electrode portions.