ELECTROMAGNETIC BAND GAP ELEMENT, AND ANTENNA AND FILTER USING THE SAME

• US 20100265159A1
• Filed: 12/26/2008
• Published: 10/21/2010
• Est. Priority Date: 12/26/2007
• Status: Active Grant

• Current Assignee: NEC Corporation
• Original Assignee: NEC Corporation
• Inventors: Ando, Noriaki, Tsukagoshi, Tsuneo, Takemura, Koichi
• Granted Patent: US 8,354,975 B2
• Time in Patent Office: Days
• US Class Current: 343/913
• CPC Class Codes: H01Q 15/008 said selective devices having Sievenpipers' mushroom elements
• CPC Class Codes: H01Q 19/10 using reflecting surfaces
• CPC Class Codes: H01Q 9/0421 with a shorting wall or a shorting pin at one end of the element H01Q9/0414 takes precedence
• CPC Class Codes: H01Q 9/42 with folded element, the folded parts being spaced apart a small fraction of the operating wavelength
• CPC Class Codes: H05K 1/0236 Electromagnetic band-gap structures
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/09309 Core having two or more power planes; Capacitive laminate of two power planes
• CPC Class Codes: H05K 9/0086 comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering

Abstract

Conductor pieces 102 that are periodically arrayed, a conductor plane 103 that has openings 104 periodically arrayed so as to correspond to the conductor pieces 102, and a dielectric 108 that is arranged between the conductor pieces 102 and the conductor plane 103, are included. Island electrodes 105 and planar inductance elements 106 are arranged in the openings 104 of the conductor plane 103. The island electrodes 105 and the conductor pieces 102 are connected by conductor posts 107. The island electrodes 105 and the conductor plane 103 are connected through the planar inductance elements 106.

Claims

16. An electromagnetic band gap device comprising:

conductor pieces that are periodically arrayed;

a conductor plane that has openings periodically arrayed so as to correspond to the conductor pieces;

island electrodes that are arranged in the openings of the conductor plane; and

inductance elements,

the conductor pieces and the island electrodes being electrically connected by conductor posts, the island electrodes and the conductor plane being connected through the inductance elements.

17. The electromagnetic band gap device according to claim 16, wherein the size of each of the openings are smaller than that of each of the conductor pieces.

18. The electromagnetic band gap device according to claim 16, wherein:

the inductance elements are formed in the openings of the conductor plane; and

either one of terminals of each of the inductance elements is connected to the conductor plane, and the other terminal is connected to each of the island electrodes.

19. The electromagnetic band gap device according to claim 16, wherein:

the inductance elements are formed in a layer different from the conductor plane; and

either one of terminals of each of the inductance elements is electrically connected to each of the island electrodes by a conductor post, and the other terminal is electrically connected to the conductor plane by a conductor post.

20. The electromagnetic band gap device according to claim 16, wherein the inductance elements are spiral coils.

21. The electromagnetic band gap device according to claim 16, wherein the inductance elements are meander coils.

22. The electromagnetic band gap device according to claim 16, wherein an insulating magnetic layer is arranged next to a conductor layer in which the inductance elements are formed.

23. The electromagnetic band gap device according to claim 16, wherein the conductor pieces form an interdigital structure in which adjoining sides interdigitate with each other.

24. The electromagnetic band gap device according to claim 16, wherein the periodic array of conductor pieces includes a first layer of first conductor pieces and a second layer of second conductor pieces, with overlapping areas where the first conductor pieces and the second conductor pieces overlap each other.

25. An antenna comprising the electromagnetic band gap device according to claim 16 as a reflector, a use frequency band of the antenna falling within a band gap frequency band of the electromagnetic band gap device.

26. The antenna according to claim 25, wherein the antenna is a patch antenna.

27. The antenna according to claim 25, wherein the antenna is an inverted F antenna.

28. A common mode filter comprising the electromagnetic band gap device according to claim 16.

29. A parallel-plate waveguide type electromagnetic band gap device comprising:

the electromagnetic band gap device according to claim 16; and

a first conductor plane, the first conductor plane and the electromagnetic band gap device being electrically insulated from each other, the periodic array of conductor pieces that constitute the electromagnetic band gap device being arranged in a layer between the first conductor plane and the conductor plane that constitutes the electromagnetic band gap device.

30. A power supply noise suppression filter comprising:

the parallel-plate waveguide type electromagnetic band gap device according to claim 29; and

parallel plates that are composed of first and second conductor planes, all or part of the parallel plates being formed as the parallel-plate waveguide type electromagnetic band gap device, either one of the first and second conductor planes being connected to a power supply, the other being grounded.

31. The electromagnetic band gap device according to claim 16, wherein each of the inductance elements is plane type.

32. The electromagnetic band gap device according claim 18, wherein each of the inductance elements is plane type, and the inductance elements and the island electrodes are formed as a conductor pattern continuous with the same conductor layer as the conductor plane to which the openings are formed.

33. The electromagnetic band gap device according claim 19, wherein each of the inductance elements is plane type, and a conductor layer to which the inductance elements of the plane type is formed is arranged at a reverse side to a placement side of a conductor layer to which the conductor pieces are formed, about the conductor plane.