TOUCH-SENSING DISPLAY APPARATUS AND FABRICATING METHOD THEREOF

• US 20100265206A1
• Filed: 02/03/2010
• Published: 10/21/2010
• Est. Priority Date: 04/21/2009
• Status: Active Grant

• Current Assignee: Industrial Technology Research Institute
• Original Assignee: Industrial Technology Research Institute
• Inventors: Chen, Kuang-Jung
• Granted Patent: US 8,723,413 B2
• Time in Patent Office: Days
• US Class Current: 345/174
• CPC Class Codes: G06F 2203/04111 Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
• CPC Class Codes: G06F 3/0412 Digitisers structurally integrated in a display
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
• CPC Class Codes: G06F 3/0446 using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
• CPC Class Codes: H10K 59/40 OLEDs integrated with touch screens

Abstract

A touch-sensing display apparatus and a fabricating method thereof are provided. The touch-sensing display apparatus includes a substrate, an organic light emitting diode (OLED) display layer, and a touch structure. The OLED display layer is between the substrate and the touch structure apparatus and directly contacts with the touch structure. The touch structure includes a first water/oxygen barrier layer, an electromagnetic interference (EMI) shielding layer, a sensing circuit layer, and a second water/oxygen barrier layer. The first water/oxygen barrier layer is located on the OLED display layer. The EMI shielding layer is located on the first water/oxygen barrier layer. The sensing circuit layer is located on the EMI shielding layer. The second water/oxygen barrier layer is located on the sensing circuit layer.

Claims

1. A touch-sensing display apparatus, comprising:

a substrate;

an organic light emitting diode display layer disposed on the substrate; and

a touch structure disposed on the organic light emitting diode display layer, wherein the organic light emitting diode display layer is connected between the substrate and the touch-sensing display apparatus, and the touch structure directly contacts with the organic light emitting diode display layer, the touch structure comprising;

a sensing circuit layer disposed on the organic light emitting diode display layer; and

a second water/oxygen barrier layer disposed on the sensing circuit layer.

2. The touch-sensing display apparatus as claimed in claim 1, wherein the organic light emitting diode display layer comprises:

an active array device disposed on the substrate;

a pair of electrode layers disposed on the substrate and covering the active array device;

an organic light emitting layer disposed between the pair of electrode layers; and

a first water/oxygen barrier layer disposed on the organic light emitting diode display layer.

3. The touch-sensing display apparatus as claimed in claim 2, wherein the touch structure further comprises an electromagnetic interference shielding layer, and the electromagnetic interference shielding layer comprises:

a first water/oxygen barrier conductive layer disposed on the first water/oxygen barrier layer;

a first circuit pattern layer connected to the first water/oxygen barrier conductive layer; and

a first water/oxygen barrier insulation layer disposed on the first water/oxygen barrier conductive layer.

4. The touch-sensing display apparatus as claimed in claim 3, wherein the sensing circuit layer further comprises a second water/oxygen barrier conductive layer disposed on the electromagnetic interference shielding layer.

5. The touch-sensing display apparatus as claimed in claim 4, wherein the sensing circuit layer further comprises a second circuit pattern layer disposed on the first water/oxygen barrier insulation layer, and the second circuit pattern layer is connected to the second water/oxygen barrier conductive layer.

6. The touch-sensing display apparatus as claimed in claim 2, wherein the touch structure further comprises an electromagnetic interference shielding layer, and the electromagnetic interference shielding layer comprises:

a first water/oxygen barrier conductive layer disposed on the first water/oxygen barrier layer, wherein the first water/oxygen barrier conductive layer is electrically connected to a first conductive wire, and the first conductive wire is disposed on the substrate; and

a first water/oxygen barrier insulation layer disposed on the first water/oxygen barrier conductive layer.

7. The touch-sensing display apparatus as claimed in claim 6, wherein the sensing circuit layer comprises:

a first patterned conductive layer disposed on the electromagnetic interference shielding layer, wherein the first patterned conductive layer is connected to a second conductive wire, and the second conductive wire is disposed on the substrate;

a second water/oxygen barrier insulation layer disposed on the first patterned conductive layer; and

a second patterned conductive layer disposed on the second water/oxygen barrier insulation layer, wherein the second patterned conductive layer is connected to a third conductive wire, and the third conductive wire is disposed on the substrate.

8. The touch-sensing display apparatus as claimed in claim 7, the first patterned conductive layer comprising a plurality of first touch electrode series extending along a first direction, each of the first touch electrode series comprising a plurality of first touch pads electrically connected to one another, the second patterned conductive layer comprising a plurality of second touch electrode series extending along a second direction, each of the second touch electrode series comprising a plurality of second touch pads electrically connected to one another, wherein the first direction is different from the second direction.

9. The touch-sensing display apparatus as claimed in claim 2, wherein the first water/oxygen barrier layer is an inorganic single-layer film, an organic single-layer film, or a combination thereof.

10. The touch-sensing display apparatus as claimed in claim 5, wherein a material of the first circuit pattern layer and the second circuit pattern layer comprises an inorganic transparent conductive material, an organic transparent conductive material, or a metal conductive material.

11. The touch-sensing display apparatus as claimed in claim 6, wherein the sensing circuit layer comprises:

a third patterned conductive layer disposed on the electromagnetic interference shielding layer, wherein the third patterned conductive layer comprises a plurality of third touch electrode series extending along a third direction, the third patterned conductive layer is connected to a second conductive wire, and the second conductive wire is disposed on the substrate; and

a fourth patterned conductive layer disposed on the electromagnetic interference shielding layer, wherein the fourth patterned conductive layer comprises a plurality of fourth touch electrode series extending along a fourth direction, the fourth patterned conductive layer is connected to a third conductive wire, the third conductive wire is disposed on the substrate, and the third direction is different from the fourth direction.

12. The touch-sensing display apparatus as claimed in claim 11, wherein each of the third touch electrode series comprises a plurality of third touch pads electrically connected to one another, each of the fourth touch electrode series comprises a plurality of fourth touch pads electrically connected to one another, and the fourth touch pads are electrically connected to one another through a bridge conductive wire.

13. The touch-sensing display apparatus as claimed in claim 3, wherein the first water/oxygen barrier insulation layer in the electromagnetic interference shielding layer comprises an inorganic single-layer film, an organic single-layer film, or a combination thereof.

14. The touch-sensing display apparatus as claimed in claim 6, wherein a material of the first water/oxygen barrier conductive layer comprises an inorganic transparent conductive material or an organic transparent conductive polymer material.

15. The touch-sensing display apparatus as claimed in claim 2, wherein a material of the first water/oxygen barrier layer comprises an organic material, an inorganic material, a transparent organic-inorganic hybrid nano-particle, an organic photoresist material, or a transparent polymer thin film material.

16. The touch-sensing display apparatus as claimed in claim 15, wherein the inorganic material comprises Al₂O₃, SiO_x, SiN_x, or SiO_xN_y, the organic material comprises parylene, acrylic, or diamond-like carbon, and the organic-inorganic hybrid nano-particle comprises a mixture of diamond-like carbon and silicon.

17. The touch-sensing display apparatus as claimed in claim 1, wherein the second water/oxygen barrier layer comprises an anti-reflection layer, an anti-glare layer, an anti-smudge layer, a hard coating layer, or a combination thereof.

18. The touch-sensing display apparatus as claimed in claim 1, wherein a material of the second water/oxygen barrier layer comprises silicon dioxide, titanium dioxide, indium oxide, arsenide oxide, zinc oxide, tantalum oxide, zirconium oxide, or diamond-like carbon.

19. The touch-sensing display apparatus as claimed in claim 1, wherein a material of the substrate comprises glass, silicon, polyethylene terephthalate, polyethylene naphthalate, polyester, polymethylmethacrylate, polycarbonate, polyimide, or a metal alloy.

20. A fabricating method of a touch-sensing display apparatus, comprising:

forming an organic light emitting diode display layer on a substrate;

forming a first water/oxygen barrier layer on the organic light emitting diode display layer; and

forming a touch structure on the organic light emitting diode display layer, wherein a method of forming the touch structure comprises;

forming a sensing circuit layer on the first water/oxygen barrier layer; and

forming a second water/oxygen barrier layer on the sensing circuit layer.

21. The fabricating method as claimed in claim 20, wherein a method of forming the organic light emitting diode display layer comprises:

forming an active array device on the substrate;

forming a pair of electrode layers on the substrate, wherein the active array device is covered by the pair of electrode layers;

forming an organic light emitting layer between the pair of electrode layers; and

forming the first water/oxygen barrier layer on the pair of electrode layers.

22. The fabricating method as claimed in claim 21, further comprising forming an electromagnetic interference shielding layer on the first water/oxygen barrier layer, wherein a method of forming the electromagnetic interference shielding layer comprises:

forming a first water/oxygen barrier conductive layer on the first water/oxygen barrier layer;

forming a first circuit pattern layer connected to the first water/oxygen barrier conductive layer; and

forming a first water/oxygen barrier insulation layer on the first water/oxygen barrier conductive layer and the first circuit pattern layer.

23. The fabricating method as claimed in claim 22, wherein a method of forming the sensing circuit layer comprises:

forming a second water/oxygen barrier conductive layer on the first water/oxygen barrier insulation layer; and

forming a second circuit pattern layer on the first water/oxygen barrier insulation layer, the second circuit pattern layer connecting the second water/oxygen barrier conductive layer.

24. The fabricating method as claimed in claim 23, wherein a method of forming the first circuit pattern layer and the second circuit pattern layer comprises performing a screen printing process, an ink jet printing process, a photolithography and etching process, or a sputtering process.

25. The fabricating method as claimed in claim 21, further comprising forming an electromagnetic interference shielding layer on the first water/oxygen barrier layer, wherein a method of forming the electromagnetic interference shielding layer comprises:

forming a first water/oxygen barrier conductive layer on the first water/oxygen barrier layer and electrically connecting the first water/oxygen barrier conductive layer to a first conductive wire located on the substrate; and

forming a first water/oxygen barrier insulation layer on the first water/oxygen barrier conductive layer.

26. The fabricating method as claimed in claim 25, wherein a method of forming the sensing circuit layer comprises:

forming a first patterned conductive layer on the first water/oxygen barrier insulation layer and electrically connecting the first patterned conductive layer to a second conductive wire located on the substrate;

forming a second water/oxygen barrier insulation layer on the first patterned conductive layer; and

forming a second patterned conductive layer on the second water/oxygen barrier insulation layer and electrically connecting the second patterned conductive layer to a third conductive wire located on the substrate.

27. The fabricating method as claimed in claim 26, wherein a method of forming the first patterned conductive layer and the second patterned conductive layer comprises:

forming a plurality of first touch electrode series on the first water/oxygen barrier insulation layer, wherein the first touch electrode series extend along a first direction, and each of the first touch electrode series comprises a plurality of first touch pads electrically connected to one another; and

forming a plurality of second touch electrode series on the second water/oxygen barrier insulation layer, wherein the second touch electrode series extend along a second direction, each of the second touch electrode series comprises a plurality of second touch pads electrically connected to one another, and the first direction is different from the second direction.

28. The fabricating method as claimed in claim 27, wherein a method of forming the first touch electrode series and the second touch electrode series comprises performing a spin coating process, a laser etching process, a photolithography and etching process, or a sputtering process.

29. The fabricating method as claimed in claim 25, wherein a method of forming the sensing circuit layer comprises:

forming a third patterned conductive layer and a fourth patterned conductive layer on the first water/oxygen barrier insulation layer and connecting the third patterned conductive layer to a second conductive wire located on the active array device, wherein the fourth patterned conductive layer is connected to a third conductive wire located on the active array device; and

forming a second water/oxygen barrier insulation layer on the third patterned conductive layer and the fourth patterned conductive layer and forming a plurality of holes on the second water/oxygen barrier insulation layer.

30. The fabricating method as claimed in claim 29, wherein a method of forming the third patterned conductive layer and the fourth patterned conductive layer comprises:

forming a plurality of third touch electrode series, wherein the third touch electrode series extend along a third direction, and each of the third touch electrode series comprises a plurality of third touch pads electrically connected to one another; and

forming a plurality of fourth touch electrode series, wherein the fourth touch electrode series extend along a fourth direction, each of the fourth touch electrode series comprises a plurality of fourth touch pads electrically connected to one another, and the third direction is different from the fourth direction.

31. The fabricating method as claimed in claim 30, further comprising forming a bridge conductive wire on the holes on the second water/oxygen barrier insulation layer to connect the fourth touch pads.

32. The fabricating method as claimed in claim 29, wherein a method of forming the third patterned conductive layer and the fourth patterned conductive layer comprises performing a screen printing process, an ink jet printing process, a photolithography and etching process, or a sputtering process.

33. The fabricating method as claimed in claim 29, wherein a method of forming the holes on the second water/oxygen barrier insulation layer comprises simultaneously forming the second water/oxygen barrier insulation layer and the holes.

34. The fabricating method as claimed in claim 31, wherein a method of forming the bridge conductive wire comprises performing a screen printing process, an ink jet printing process, a photolithography and etching process, or a sputtering process.

35. The fabricating method as claimed in claim 20, wherein a method of forming the second water/oxygen barrier layer comprises performing an electron beam evaporation process, a sputtering process, a spin coating process, a dipping process, a spray process, a flow coating process, an ink jet printing process, or a chemical vapor deposition process.