PACKAGE STRUCTURE OF PRINTED CIRCUIT BOARD AND PACKAGE METHOD THEREOF

• US 20100265671A1
• Filed: 08/07/2009
• Published: 10/21/2010
• Est. Priority Date: 04/16/2009
• Status: Abandoned Application

• Current Assignee: Lite-On Technology Corporation, Silitek Electronic Company Limited (Lite-On Technology Corporation)
• Original Assignee: Lite-On Technology Corporation, Silitek Electronic Company Limited (Lite-On Technology Corporation)
• Inventors: TSENG, CHENG-TE, TSAI, CHIA-HSI, LIN, YI-TING, CHEN, TZU-KAN
• Application Number:
  US12/537,441
• Publication Number:
  US 20100265671A1
• Time in Patent Office: Days
• US Class Current: 361/749
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48 of an individual wire connector
• CPC Class Codes: H01L 23/49805 the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/0105 Tin [Sn]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/30107 Inductance
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 2201/10689 Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
• CPC Class Codes: H05K 2201/2018 Presence of a frame in a printed circuit or printed circuit assembly
• CPC Class Codes: H05K 2203/1316 Moulded encapsulation of mounted components
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.

Abstract

The package structure of the PCB comprises a substrate and a frame. The frame is located at the top of the substrate, and the substrate and the frame define a receiving space. The electronic components are mounted on the substrate and distributed in the receiving space. Because of the protection of the frame, the electronic components are effectively protected from the collision of installation in the process or use in the process. The substrate can be a flexible circuit board or a rigid-flex PCB and the electronic components are directly embedded in the substrate. Therefore the thickness of the package structure is reduced.

Claims

1. A package structure of printed circuit board, comprising:

a substrate and a frame, the frame disposed on the substrate to form a receiving space, and a plurality of electronic components mounted on the substrate and received inside the receiving space.

2. The package structure of printed circuit board according to claim 1, wherein the frame is aligned to the peripheral edges of the substrate.

3. The package structure of printed circuit board according to claim 1, wherein the frame extends on the sides of the substrate and partially covers the sides of the substrate, or the frame extends to a bottom of the substrate.

4. The package structure of printed circuit board according to claim 1, wherein the frame further has a plurality of conductive hole portions, and the conductive hole portions are connected electrically to the substrate.

5. The package structure of printed circuit board according to claim 1, wherein a height of the frame is higher than or equal to a height of each of the electronic components.

6. The package structure of printed circuit board according to claim 1, wherein the substrate is a printed circuit board, a FPC, a rigid-flex board, or a ceramic board.

7. The package structure of printed circuit board according to claim 1, wherein the frame is made of thermoplastic materials.

8. A package structure of printed circuit board, comprising:

a substrate and at least one electronic component, the substrate having a receiving hole therein, the electronic component disposed in the receiving hole and fixed to the substrate via a frame.

9. The package structure of printed circuit board according to claim 8, wherein the frame is made of packaging material, and the packaging material covers the electronic component by an insert-molding method.

10. The package structure of printed circuit board according to claim 8, wherein the substrate is a FPC, or a rigid-flex board.

11. A package method of printed circuit board, comprising steps of:

step 1;

mounting a plurality of electronic components on a substrate; and

step 2;

forming a frame on the substrate, the frame being aligned with periphery edges of the substrate, or extending to sides or bottom of the substrate so that the electronic components are received in a receiving space formed by the substrate and the frame.

12. The package method of printed circuit board according to claim 11, wherein the steps 1 through 2 are performed in reverse sequence.

13. The package method of printed circuit board according to claim 11, further comprising a step 3:

forming a plurality of conductive hole portions on sides of the frame via etching/electro-plating processes after step 2.

14. A package method of printed circuit board, comprising steps of:

step 1;

forming a receiving hole on a substrate;

step 2;

providing the substrate and at least one electronic component on a mold;

step 3;

forming a frame to fix the electronic component in the receiving hole of the substrate.

15. The package method of printed circuit board according to claim 14, wherein the substrate is a FPC, or a rigid-flex board.