PACKAGE STRUCTURE OF PRINTED CIRCUIT BOARD AND PACKAGE METHOD THEREOF
First Claim
Patent Images
1. A package structure of printed circuit board, comprising:
- a substrate and a frame, the frame disposed on the substrate to form a receiving space, and a plurality of electronic components mounted on the substrate and received inside the receiving space.
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Abstract
The package structure of the PCB comprises a substrate and a frame. The frame is located at the top of the substrate, and the substrate and the frame define a receiving space. The electronic components are mounted on the substrate and distributed in the receiving space. Because of the protection of the frame, the electronic components are effectively protected from the collision of installation in the process or use in the process. The substrate can be a flexible circuit board or a rigid-flex PCB and the electronic components are directly embedded in the substrate. Therefore the thickness of the package structure is reduced.
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Citations
15 Claims
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1. A package structure of printed circuit board, comprising:
- a substrate and a frame, the frame disposed on the substrate to form a receiving space, and a plurality of electronic components mounted on the substrate and received inside the receiving space.
- View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A package structure of printed circuit board, comprising:
- a substrate and at least one electronic component, the substrate having a receiving hole therein, the electronic component disposed in the receiving hole and fixed to the substrate via a frame.
- View Dependent Claims (9, 10)
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11. A package method of printed circuit board, comprising steps of:
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step 1;
mounting a plurality of electronic components on a substrate; andstep 2;
forming a frame on the substrate, the frame being aligned with periphery edges of the substrate, or extending to sides or bottom of the substrate so that the electronic components are received in a receiving space formed by the substrate and the frame. - View Dependent Claims (12, 13)
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14. A package method of printed circuit board, comprising steps of:
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step 1;
forming a receiving hole on a substrate;step 2;
providing the substrate and at least one electronic component on a mold;step 3;
forming a frame to fix the electronic component in the receiving hole of the substrate. - View Dependent Claims (15)
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Specification