WAFER BONDING OF MICRO-ELECTRO MECHANICAL SYSTEMS TO ACTIVE CIRCUITRY
First Claim
1. A single integrated wafer package comprising:
- a micro electromechanical system (MEMS) wafer with a first surface, the MEMS wafer having at least one MEMS component on its first surface;
an active device wafer with a first surface, the active device wafer having an active device circuit on its first surface;
a seal ring adjacent the first surface of the MEMS wafer such that a seal is formed about the MEMS component; and
an external contact to the wafer package, wherein the external contact accessible externally to the wafer package and is electrically coupled to the active device circuit of the active device wafer.
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Accused Products
Abstract
A single integrated wafer package includes a micro electromechanical system (MEMS) wafer, an active device wafer, and a seal ring. The MEMS wafer has a first surface and includes at least one MEMS component on its first surface. The active device wafer has a first surface and includes an active device circuit on its first surface. The seal ring is adjacent the first surface of the MEMS wafer such that a seal is formed about the MEMS component. An external contact is provided on the wafer package. The external contact is accessible externally to the wafer package and is electrically coupled to the active device circuit of the active device wafer.
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Citations
25 Claims
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1. A single integrated wafer package comprising:
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a micro electromechanical system (MEMS) wafer with a first surface, the MEMS wafer having at least one MEMS component on its first surface; an active device wafer with a first surface, the active device wafer having an active device circuit on its first surface; a seal ring adjacent the first surface of the MEMS wafer such that a seal is formed about the MEMS component; and an external contact to the wafer package, wherein the external contact accessible externally to the wafer package and is electrically coupled to the active device circuit of the active device wafer. - View Dependent Claims (2, 3, 4, 5, 6, 8, 10, 11, 12, 13, 14)
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- 7. The wafer package of clam 1, wherein the MEMS wafer further includes at least one via through which an electrical connection is made between the external contact and at least one of the group comprising the active device circuit and the MEMS component.
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15. A method for fabricating a wafer package comprising:
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providing an active device wafer with a first surface, the active device wafer having an active device circuit on its first surface; providing a micro electromechanical system (MEMS) wafer with a first surface, the MEMS wafer having at least one MEMS component on its first surface; attaching the microcap and a seal ring adjacent the MEMS wafer such that seal ring and microcap seal the MEMS component; forming vias in the microcap; fabricating contacts within the vias that are electrically coupled to the MEMS wafer; fabricating columns between the active device wafer and the contacts thereby electrically coupling the active device wafer and the MEMS wafer; and providing an electrical contact point to the wafer package that is accessible externally to the wafer package. - View Dependent Claims (16, 17, 18, 19, 20)
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21. A method for fabricating a wafer package comprising:
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providing an active device wafer with a first surface, the active device wafer having an active device circuit on its first surface; placing a micro electromechanical system (MEMS) wafer with a first surface adjacent the first surface of the active device wafer, the MEMS wafer having at least one MEMS component on its first surface; fabricating columns between the active device wafer and the MEMS wafer thereby electrically coupling the active device circuit and the MEMS wafer, including forming a ring column surrounding and thereby sealing the MEMS component between the active device wafer and the MEMS wafer; forming at least one via in at least one of the group comprising the MEMS wafer and the active device wafer; fabricating a via contact within the via that is electrically coupled to at least one of the columns; and providing an external contact coupled to via contact, wherein the external contact is accessible externally to the wafer package and is electrically coupled to at least one of the group comprising the MEMS component and the active device circuit. - View Dependent Claims (22, 23, 24, 25)
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Specification