LAMINATED STRUCTURE FOR CIS BASED SOLAR CELL, AND INTEGRATED STRUCTURE AND MANUFACTURING METHOD FOR CIS BASED THIN-FILM SOLAR CELL
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Abstract
This invention aims to provide a laminated structure and an integrated structure of a high production efficiency for a CIS based thin-film solar cell, which can produce a high-resistance buffer layer of the CIS based thin-film solar cell efficiently on a series of production lines and which needs no treatment of wastes or the like, and a manufacturing method for the structures. The CIS based thin-film solar cell includes a back electrode, a p-type CIS based light absorbing layer, a high-resistance buffer layer and an n-type transparent conductive film laminated in this order. The high-resistance buffer layer and the n-type transparent conductive film are formed of thin films of a zinc oxide group. The buffer layer contacts the p-type CIS based light absorbing layer directly, and has a resistivity of 500 Ω·cm or higher.
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Citations
29 Claims
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1-22. -22. (canceled)
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23. A method for manufacturing a CIS based thin-film solar cell, comprising the steps of:
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making a back electrode on a substrate; forming a p-type CIS based light absorbing layer on the back electrode; forming a buffer layer formed of a thin film of a zinc oxide group directly on the p-type CIS based light absorbing layer; and forming an n-type transparent conductive film formed of the thin film of a zinc oxide group on the buffer layer, wherein the buffer layer forming step is performed by an MOCVD method, and a substrate temperature of the buffer layer forming step is made higher than the substrate temperature at the time of forming the n-type transparent conductive film. - View Dependent Claims (24, 25, 28)
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26. A method for manufacturing a CIS based thin-film solar cell, comprising the steps of:
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making a back electrode on a substrate; forming a p-type CIS based light absorbing layer on the back electrode; forming a buffer layer formed of a thin film of a zinc oxide group directly on the p-type CIS based light absorbing layer; and forming an n-type transparent conductive film formed of the thin film of a zinc oxide group on the buffer layer, wherein the buffer layer forming step and the n-type transparent conductive film forming step are performed by an MOCVD method, and a material molar ratio ([O]/[Zn]) of the buffer layer forming step is made higher than the material molar ratio ([O]/[Zn]) of the n-type transparent conductive film forming step. - View Dependent Claims (27, 29)
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Specification