Substrate holder and substrate holding method
First Claim
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1. A substrate holder for holding a substrate by vacuum suction, said substrate holder comprising:
- a substrate-holding stage having a suction surface for the substrate; and
a fluid passage selectively coupled to a vacuum source and a fluid supply source,wherein said suction surface has a plurality of closed sections surrounded by convexities, andwherein said fluid passage includes a plurality of communication passages which are in fluid communication with said plurality of closed segments respectively and independently.
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Abstract
A substrate holder is a mechanism for holding a substrate, to be polished, by vacuum suction. The substrate holder includes a substrate-holding stage having a suction surface for the substrate, and a fluid passage selectively coupled to a vacuum source and a fluid supply source. The suction surface has a plurality of closed sections surrounded by convexities, and the fluid passage includes a plurality of communication passages which are in fluid communication with the plurality of closed segments respectively and independently.
27 Citations
11 Claims
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1. A substrate holder for holding a substrate by vacuum suction, said substrate holder comprising:
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a substrate-holding stage having a suction surface for the substrate; and a fluid passage selectively coupled to a vacuum source and a fluid supply source, wherein said suction surface has a plurality of closed sections surrounded by convexities, and wherein said fluid passage includes a plurality of communication passages which are in fluid communication with said plurality of closed segments respectively and independently. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of holding a substrate, said method comprising:
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holding the substrate via vacuum suction by a substrate holder; performing a first process on the substrate while holding the substrate; after said first process, lowering a degree of vacuum of the vacuum suction; performing a second process on the substrate while holding the substrate with the lowered degree of vacuum; and after said second process, releasing the substrate from the substrate holder by blowing a fluid to the substrate. - View Dependent Claims (10, 11)
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Specification