Monitoring system and method for electronic device

• US 20100268481A1
• Filed: 06/11/2009
• Published: 10/21/2010
• Est. Priority Date: 04/17/2009
• Status: Abandoned Application

• Current Assignee: Hon Hai Precision Industry Co., Ltd.
• Original Assignee: Hon Hai Precision Industry Co., Ltd.
• Inventors: Lee, Mario John Dominic
• Application Number:
  US12/456,059
• Publication Number:
  US 20100268481A1
• Time in Patent Office: Days
• US Class Current: 702/34
• CPC Class Codes: G06F 11/3034 where the computing system component is a storage system, e.g. DASD based or network based digital input from or digital output to record carriers G06F3/06; digital recording or reproducing G11B20/18; for distributed storage of data in networks, e.g. transport arrangements for network file system [NFS], storage area networks [SAN] or network attached storage [NAS], H04L67/1097
• CPC Class Codes: G06F 11/3058 Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations thermal management in cooling arrangements of a computing system G06F1/206
• CPC Class Codes: G06F 11/3072 where the reporting involves data filtering, e.g. pattern matching, time or event triggered, adaptive or policy-based reporting
• CPC Class Codes: G11B 5/5582 system adaptation for working during or after external perturbation, e.g. in the presence of a mechanical oscillation caused by a shock

Abstract

A system includes a device, a sensor connected to the device, and a processing module connected to the sensor. The sensor detects shock and vibration of the device and stores the shock and vibration data. The processing module receives the shock and vibration data from the sensor and predicts useful life of the vibrating device.

Claims

1. A system comprising:

a device;

a sensor connected to the device and capable of detecting shock and vibration of the device and storing the shock and vibration data; and

a processing module connected to the sensor and capable of receiving the shock and vibration data from the sensor and predicting a life of the vibrating device.

2. The system of claim 1, wherein the sensor is a micro electro mechanical accelerometer.

3. The system of claim 1, wherein the device is a hard disk drive.

4. The system of claim 1, wherein the device is a fan.

5. The system of claim 1, wherein the processing module comprises a parameter setting module, the parameter setting module stores predetermined parameters.

6. The system of claim 5, wherein the processing module further comprises a comparing module, the comparing module compares the shock and vibration data of the hard disk drive with the predetermined parameters.

7. The system of claim 6, further comprising a display module capable of sending the shock and vibration data and the comparing result to a display.

8. The system of claim 7, wherein the processing module further comprises an input module for receiving the shock and vibrating data and an output module for sending the shock and vibration data and the comparing result to the display module.

9. A method comprising:

attaching an accelerometer to a hard disk drive;

connecting a processing module to the accelerometer;

the accelerometer collecting the shock and vibrating data of the hard disk drive; and

the processing module receiving the shock and vibrating data and predicting an expected life of the hard disk drive.

10. The method of claim 9, further comprising setting predetermined parameters.

11. The method of claim 10, further comprising comparing the shock and vibrating data with the predetermined parameters.

12. The method of claim 11, wherein the predetermined parameters comprises a period of time for which the hard disk drive is expected to endure the vibration.

13. The method of claim 12, further showing a notice of a possible hard disk drive failure on a display module if the shock and vibration data exceeds the value of the period of time.

14. The method of claim 11, further comprising sending the shock and vibration data and the comparing result to a display module.