LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM INCLUDING THE SAME

• US 20100270579A1
• Filed: 04/27/2010
• Published: 10/28/2010
• Est. Priority Date: 04/28/2009
• Status: Active Grant

• Current Assignee: Suzhou Lekin Semiconductor Company Limited
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: JO, Kyoung Woo
• Granted Patent: US 9,401,467 B2
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/10158 at the passive surface
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

Provided are a light emitting device (LED) package and a lighting system including the same. The LED package comprises a package body comprising a recess in an upper portion thereof, and an LED chip provided in the recess of the package body.

Claims

1. A light emitting device (LED) package comprising:

a package body having a planar surface and a recess formed on the planar surface such that a bottom surface of the recess is lower than the planar surface; and

an LED chip comprising a substrate, a first conductive type semiconductor layer on the substrate, an active layer on the first conductive type semiconductor layer and a second conductive type semiconductor layer on the active layer, the LED chip being provided in the recess such that a bottom surface of the LED chip is below the planar surface of the package body, wherein heat generated by the LED chip is dissipated through the bottom surface and a lateral surface of the LED chip to the package body.

2. The LED package of claim 1, wherein the lateral surface of the LED chip comprises a first section perpendicular to the bottom surface of the LED chip and a second section having an inclined angle to the bottom surface of the LED chip.

3. The LED package of claim 2, wherein a side surface of the recess includes an inclined angle which is substantially same as the inclined angle of the second section of the LED chip.

4. The LED package of claim 2, wherein the angle of the second section is about 30 degrees to about 90 degrees.

5. The LED package of claim 2, wherein a top surface of the LED chip is above the planar surface of the package body.

6. The LED package of claim 1, further comprising a solder between the LED chip and the recess of the package body.

7. The LED package of claim 1, wherein the substrate of the LED chip includes a contour corresponding to a contour of the recess.

8. The LED package of claim 1, further comprising a first electrode electrically connecting to a bottom surface of the LED chip;

and a second electrode electrically connecting to an upper surface of the LED chip.

9. The LED package of claim 2, wherein the first section in which the lateral surface of the LED chip is perpendicular to the bottom surface has a height of less than about 100 μ

m.

10. A lighting system comprising a light emitting module comprising the LED package of claim 1.

11. A method for fabricating a light emitting device (LED) package comprising:

forming a recess on a planar surface of a package body such that a bottom surface of the recess is lower than the planar surface;

assembling an LED chip comprising placing a first conductive type semiconductor layer on a substrate, placing an active layer on the first conductive type semiconductor layer, placing a second conductive type semiconductor layer on the active layer; and

placing the LED chip inside the recess such that a bottom surface of the LED chip is below the planar surface of the package body, wherein heat generated by the LED chip is dissipated through the bottom surface and a lateral surface of the LED chip to the package body.

12. The method of claim 11, wherein forming the recess comprises an etching process to form a side surface inclined at an angle with respect to the bottom surface of the recess.

13. The method of claim 11, wherein forming the recess and the LED chip further comprises shaping the substrate of the LED chip to have a contour corresponding to a contour of the recess.

14. The method of claim 11, wherein the package body comprises an upper portion being a different material than the package body, and wherein the recess is formed in the upper portion of the package body.

15. The method of claim 11, wherein the LED chip is one of a vertical type LED chip or a lateral type LED chip.

16. The method of claim 11, wherein placing the LED chip inside the recess further comprises:

cutting the substrate to create the lateral surface of the LED chip at an incline, wherein an angle of the incline of the lateral surface is about 30 degrees to about 90 degrees to a plane along the bottom surface of the LED chip, and wherein the angle of the incline of the lateral surface is substantially the same as an angle of an incline of a side surface of the recess;

placing a solder in the recess of the package body; and

placing the LED chip on the solder, wherein a top surface of the LED chip is above the planar surface of the package body.

17. The method of claim 16, further comprising electrically connecting a first electrode to a bottom surface of the LED chip;

and electrically connecting a second electrode to an upper surface of the LED chip.

18. The method of claim 17, further comprising providing a reflective layer on the bottom surface and the inclined side surface of the cavity to increase an optical reflectance.

19. The method of claim 18, further comprising molding a lens to cover the cavity of the package body, wherein the lens varies a wavelength of light emitted from the LED chip.

20. A lighting system comprising the LED package of claim 19.