NITRIDE SEMICONDUCTOR WAFER
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Abstract
A nitride semiconductor wafer is planar-processed by grinding a bottom surface of the wafer, etching the bottom surface by, e.g., KOH for removing a bottom process-induced degradation layer, chamfering by a rubber whetstone bonded with 100 wt %-60 wt % #3000-#600 diamond granules and 0 wt %-40 wt % oxide granules, grinding and polishing a top surface of the wafer, etching the top surface for eliminating a top process-induced degradation layer and maintaining a 0.5 μm-10 μm thick edge process-induced degradation layer.
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Citations
21 Claims
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1-12. -12. (canceled)
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13. A nitride semiconductor wafer having a chamfered edge, a 0.5 μ
- m-10 μ
m thick edge process-induced degradation layer with a deformed lattice structure remaining on the chamfered edge and a mirror-flat top surface. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
- m-10 μ
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21. A nitride semiconductor wafer having a chamfered edge formed by a rubber-bonding whetstone, a 1 μ
- m-3 μ
m thick edge process-induced degradation layer with a deformed lattice structure remaining on the chamfered edge, and a minor-flat top surface.
- m-3 μ
Specification