LED HEAT SINK MODULE, LED MODULE FOR LED HEAT SINK MODULE
First Claim
1. A LED heat sink module, comprising:
- a LED module, said LED module comprising a circuit substrate, said circuit substrate having opposing first and second bearing walls, at least one LED chip installed in said first bearing wall of said circuit substrate, a packing cup molded on said circuit substrate around said at least one LED chip, said packing cup having a retaining portion located on the periphery thereof, and a lens molded on said packing cup over said at least one LED chip;
a heat sink adapted for dissipating waste heat from said LED module, said heat sink comprising a base and a flat mounting block located on a bottom side of said base, said flat mounting block having a flat contact face adapted for stopping against said second bearing wall of said circuit substrate of said LED module; and
a bracket adapted for securing said LED module to said head sink, said bracket comprising a center opening for receiving said circuit substrate of said LED module, a plurality of first retaining members equiangularly spaced around a bottom side thereof and adapted for securing said retaining portion of said packing cup and a plurality of second retaining members equiangularly spaced around a top side thereof and adapted for securing said flat mounting block of said heat sink.
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Accused Products
Abstract
A LED head sink module includes a LED module, which comprises a circuit substrate, a LED chip installed in the circuit substrate, a packing cup molded on the circuit substrate around the LED chip and a lens molded on the packing cup over the LED chip, a heat sink, which has a base and a flat mounting block located on the bottom side of the base for stopping against the circuit substrate of the LED module for absorbing waste heat, a bracket, which has a center opening that receives the circuit substrate of the LED module, first retaining members for fastening to a retaining portion at the periphery of the packing cup and second retaining members for fastening to the flat mounting block of the heat sink, and a water seal sandwiched between the LED module and the bracket to seal off outside moisture and dust.
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Citations
21 Claims
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1. A LED heat sink module, comprising:
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a LED module, said LED module comprising a circuit substrate, said circuit substrate having opposing first and second bearing walls, at least one LED chip installed in said first bearing wall of said circuit substrate, a packing cup molded on said circuit substrate around said at least one LED chip, said packing cup having a retaining portion located on the periphery thereof, and a lens molded on said packing cup over said at least one LED chip; a heat sink adapted for dissipating waste heat from said LED module, said heat sink comprising a base and a flat mounting block located on a bottom side of said base, said flat mounting block having a flat contact face adapted for stopping against said second bearing wall of said circuit substrate of said LED module; and a bracket adapted for securing said LED module to said head sink, said bracket comprising a center opening for receiving said circuit substrate of said LED module, a plurality of first retaining members equiangularly spaced around a bottom side thereof and adapted for securing said retaining portion of said packing cup and a plurality of second retaining members equiangularly spaced around a top side thereof and adapted for securing said flat mounting block of said heat sink. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A LED module, comprising:
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a circuit substrate, said circuit substrate having two opposing bearing walls; a plurality of tubular conducting terminals fixedly fastened to said circuit substrate for connection to an external power source; at least one LED chip installed in one said bearing wall of said circuit substrate and electrically connected to said tubular conducting terminals; a packing cup molded on said circuit substrate around said at least one LED chip, said packing cup having a retaining portion located on the periphery thereof; and a lens molded on said packing cup over said at least one LED chip. - View Dependent Claims (17, 18, 19, 20, 21)
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Specification