ELECTRONIC DEVICE CASE, METHOD AND MOLD FOR MANUFACTURING THE SAME, AND MOBILE COMMUNICATIONS TERMINAL

• US 20100271270A1
• Filed: 10/29/2009
• Published: 10/28/2010
• Est. Priority Date: 04/23/2009
• Status: Active Grant

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Park, Hyun Do, SUNG, Jae Suk, Cho, Sung Eun, Chang, Ki Won, Lee, Dae Kyu, Kim, Tae Sung, Lim, Dae Ki, Jeon, Dae Seong, Hong, Ha Ryong, Seo, Nam II
• Granted Patent: US 8,618,989 B2
• Time in Patent Office: Days
• US Class Current: 343/702
• CPC Class Codes: B29C 45/14065 Positioning or centering articles in the mould
• CPC Class Codes: B29C 45/14639 for obtaining an insulating effect, e.g. for electrical components
• CPC Class Codes: B29D 99/006 Producing casings, e.g. accumulator cases
• CPC Class Codes: B29L 2031/3456 Antennas, e.g. radomes
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 1/40 Radiating elements coated with or embedded in protective material
• CPC Class Codes: H01Q 1/42 Housings not intimately mechanically associated with radiating elements, e.g. radome
• CPC Class Codes: H01Q 9/0421 with a shorting wall or a shorting pin at one end of the element H01Q9/0414 takes precedence
• CPC Class Codes: H04M 1/026 Details of the structure or mounting of specific components
• CPC Class Codes: H04W 88/02 Terminal devices

Abstract

An electronic device case having an antenna pattern embedded therein according to an aspect of the invention may include: a radiator having an antenna pattern portion transmitting and receiving a signal and a connection terminal portion allowing the signal to be transmitted to and received from a circuit board of an electronic device; a connection portion partially forming the radiator and connecting the antenna pattern portion and the connection terminal portion to be arranged in different planes; a radiator frame manufactured by injection molding on the radiator so that the antenna pattern portion of the radiator is provided on one side of the radiator frame and the connection terminal portion is provided on the other side thereof; and a case frame covering the one side of the radiator frame on which the antenna pattern portion is provided so that the antenna pattern portion is embedded between the case frame and the radiator frame.

Claims

1. An electronic device case having an antenna pattern embedded therein, the electronic case comprising:

a radiator having an antenna pattern portion transmitting and receiving a signal and a connection terminal portion allowing the signal to be transmitted to and received from a circuit board of an electronic device;

a connection portion partially forming the radiator and connecting the antenna pattern portion and the connection terminal portion to be arranged in different planes;

a radiator frame manufactured by injection molding on the radiator so that the antenna pattern portion of the radiator is provided on one side of the radiator frame and the connection terminal portion is provided on the other side thereof; and

a case frame covering the one side of the radiator frame on which the antenna pattern portion is provided so that the antenna pattern portion is embedded between the case frame and the radiator frame.

2. The electronic device case of claim 1, wherein the case frame is an injection molded part and has a recess corresponding to the one side of the radiator frame.

3. The electronic device case of claim 1, wherein the case frame is manufactured using injection molding on the radiator frame.

4. The electronic device case of claim 1, wherein the radiator is bent to provide the connection terminal portion, the antenna pattern portion, and the connection portion connected therebetween.

5. The electronic device case of claim 1, wherein the connection terminal portion is supported by a radiator support portion on the other side of the radiator frame.

6. The electronic device case of claim 1, wherein the connection terminal portion is provided through the radiator support portion on the other side of the radiator frame.

7. The electronic device case of claim 1, wherein the radiator frame, the case frame, or the radiator frame and the case frame have a curved portion so that the radiator has a curvature.

8. An electronic device case having an antenna pattern embedded therein, the electronic case comprising:

a radiator having an antenna pattern portion transmitting and receiving a signal;

a connection terminal separated from the antenna pattern portion and having a connection terminal portion allowing the signal of the antenna pattern portion to be transmitted to or received from a circuit board of an electronic device;

an antenna pattern frame manufactured by injection molding so that the antenna pattern portion is provided on one side of the antenna pattern portion, the connection terminal portion is provided on the other side thereof, and the radiator makes contact with the connection terminal; and

a case frame covering the one side of the antenna pattern frame having the antenna pattern portion so that the antenna pattern portion is embedded between the case frame and the radiator frame.

9. A method of manufacturing an electronic device case, the method comprising:

providing a radiator having an antenna pattern portion transmitting and receiving a signal, a connection terminal portion making contact with a circuit board of an electronic device, and a connection portion connecting the antenna pattern portion and the connection terminal portion to be arranged in different planes;

arranging the radiator in a space inside an upper or lower mold for manufacturing a radiator frame and injecting a resin material therein to form the radiator frame having the antenna pattern portion formed on one side thereof; and

forming the radiator frame integrally with a case frame so that the radiator is embedded between the radiator frame and the case frame.

10. The method of claim 9, wherein the case frame is a separate injection molded part having a radiator receiving recess having a shape corresponding to the radiator frame, and

the radiator frame is bonded to the radiator receiving recess.

11. The method of claim 9, wherein double injection molding is performed by arranging the radiator frame in a mold for manufacturing an electronic device case having a space corresponding to the case frame, and injecting a resin material into the space.

12. The method of claim 9, wherein the radiator frame is manufactured by injection molding while the antenna pattern portion is arranged in contact with one surface of one of the upper and lower molds, and the connection terminal portion is arranged in contact with one surface of the other mold.

13. The method of claim 9, wherein injection molding is performed while the connection terminal portion is arranged in a radiator support portion forming recess provided in the upper or lower mold for manufacturing the radiator frame so that the connection terminal portion is supported by a radiator support portion on the other side of the radiator frame.

14. The method of claim 9, wherein injection molding is performed while the connection terminal portion is arranged in a radiator support portion forming recess provided in the upper or lower mold for manufacturing the radiator frame so that the connection portion is formed through the radiator support portion on the other side of the radiator frame.

15. The method of claim 9, wherein the radiator frame, the case frame, or the radiator frame and the case frame have a curved portion so that the radiator has a curvature.

16. A mold for manufacturing an electronic device case, the mold comprising:

an upper or lower mold for manufacturing an electronic device case receiving a radiator frame manufactured by injection molding on a radiator having an antenna pattern portion transmitting and receiving a signal, a connection terminal portion making contact with a circuit board of the electronic device, and a connection portion connecting the antenna pattern portion and the connection terminal portion to be arranged in different planes; and

a resin material injection portion provided through the upper mold, the lower mold, or the upper and lower molds, the resin material injection portion through which a resin material is injected into a space created between the upper and lower molds so that the resin material filling the space therebetween forms a case of the electronic device when the upper and lower molds are joined.

17. The mold of claim 16, wherein a guide pin, a contact pin or a guide pin and a contact pin are provided in the upper or lower mold for manufacturing the electronic device case and are injected into or make contact with a guide pin hole, a contact pin hole or a guide pin hole and a contact pin hole provided in the radiator frame.

18. The mold of claim 16, wherein the space created between the upper and lower molds has a shape corresponding to a curved portion of the electronic device case.

19. A mobile communications terminal comprising:

a radiator frame manufactured by injection molding on a radiator having an antenna pattern portion, a connection terminal portion and a connection portion connecting the antenna pattern portion and the connection terminal portion to be arranged in different planes, so that the antenna pattern portion is provided on one side of the radiator frame and the connection terminal portion is provided on the other side thereof;

a case frame covering the one side of the radiator frame on which the antenna frame is provided so that the antenna pattern portion is embedded between the case frame and the radiator frame; and

a circuit board connected to the connection terminal portion and transmitting and receiving a signal of the radiator.

20. The mobile communications terminal of claim 19, wherein the case frame is an injection molded part and has a recess corresponding to the one side of the radiator frame.

21. The mobile communications terminal of claim 19, wherein the case frame is manufactured using injection molding on the radiator frame.

22. The mobile communications terminal of claim 19, wherein the radiator is bent to provide the antenna pattern portion, the connection terminal portion, and the connection portion connected therebetween.

23. The mobile communications terminal of claim 19, wherein the connection terminal portion is supported by a radiator support portion on the other side of the radiator frame.

24. The mobile communications terminal of claim 19, wherein the connection terminal portion is formed through the radiator support portion on the other side of the radiator frame.

25. The mobile communications terminal of claim 19, wherein the radiator frame, the case frame, or the radiator frame and the case frame have a curved portion so that the radiator has a curvature.

26. A mobile communications terminal comprising:

a radiator having an antenna pattern portion transmitting and receiving a signal;

a connection terminal separated from the antenna pattern portion and having a connection terminal portion allowing the signal of the antenna pattern portion to be transmitted to and received from a circuit board of an electronic device;

an antenna pattern frame manufactured by injection molding so that the antenna pattern portion is provided on one side of the antenna pattern frame, the connection terminal portion is provided on the other side thereof, and the radiator makes contact with the connection terminal; and

a case frame covering the one side of the antenna pattern frame on which the antenna pattern portion is provided so that the antenna pattern portion is embedded between the case frame and the antenna pattern frame.