ANTENNA PATTERN FRAME, METHOD AND MOLD FOR MANUFACTURING THE SAME, AND ELECTRONIC DEVICE

• US 20100271272A1
• Filed: 12/30/2009
• Published: 10/28/2010
• Est. Priority Date: 04/23/2009
• Status: Active Grant

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Lee, Byung Hwa, Bae, Sang Woo, Nam, Hyun Kil, Han, Chang Mok, Chang, Ki Won, Lee, Dae Kyu, An, Chan Gwang, Sung, Jae Suk, Hong, Ha Ryong, Lee, Duk Woo
• Granted Patent: US 8,982,009 B2
• Time in Patent Office: Days
• US Class Current: 343/702
• CPC Class Codes: B29C 45/14065 Positioning or centering articles in the mould
• CPC Class Codes: B29C 45/14639 for obtaining an insulating effect, e.g. for electrical components
• CPC Class Codes: B29K 2101/00 Use of unspecified macromolecular compounds as moulding material use of unspecified rubbers B29K2021/00
• CPC Class Codes: B29K 2705/00 Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
• CPC Class Codes: B29L 2031/3456 Antennas, e.g. radomes
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 1/40 Radiating elements coated with or embedded in protective material
• CPC Class Codes: H01Q 5/371 Branching current paths
• CPC Class Codes: H01Q 9/0421 with a shorting wall or a shorting pin at one end of the element H01Q9/0414 takes precedence
• CPC Class Codes: H01Q 9/42 with folded element, the folded parts being spaced apart a small fraction of the operating wavelength

Abstract

An antenna pattern frame according to an aspect of the invention may include: a radiator having an antenna pattern portion transmitting and receiving a signal; a ground portion extending from the antenna pattern portion; a connection portion connecting the antenna pattern portion and the ground portion to be arranged in different planes; and a radiator frame manufactured by injection molding on the radiator so that the antenna pattern portion may be provided on one side of the radiator frame and the connection terminal portion may be provided on the other side thereof, the radiator frame allowing the antenna pattern portion to be embedded in the electronic device case.

Claims

1. An antenna pattern frame comprising:

a radiator having an antenna pattern portion transmitting and receiving a signal;

a ground portion extending from the antenna pattern portion;

a connection portion connecting the antenna pattern portion and the ground portion to be arranged in different planes; and

a radiator frame manufactured by injection molding on the radiator so that the antenna pattern portion is provided on one side of the radiator frame and the connection terminal portion is provided on the other side thereof, the radiator frame allowing the antenna pattern portion to be embedded in the electronic device case.

2. The antenna pattern frame of claim 1, wherein the radiator further comprises a connection terminal portion provided in a different plane from the antenna pattern portion, provided on the other side of the radiator frame and transmitting the signal to a circuit board of the electronic device.

3. The antenna pattern frame of claim 1, wherein the connection portion is provided by bending the radiator, the ground portion is provided by bending the connection portion, and the connection portion is provided through the radiator frame.

4. The antenna pattern frame of claim 1, wherein the ground portion is supported by a ground portion support stepped with respect to the radiator frame.

5. The antenna pattern frame of claim 1, wherein a contact pin hole is provided in the radiator so that a contact pin of a mold is inserted into the contact pin hole during injection molding to thereby prevent a movement of the radiator inside the mold.

6. The antenna pattern frame of claim 1, wherein a guide pin hole is provided in the radiator so that a guide pin of a mold is inserted into the guide pin hole during injection molding to thereby prevent a movement of the radiator inside the mold.

7. A method of manufacturing an antenna pattern frame, the method comprising:

providing a radiator having an antenna pattern portion receiving a signal, a ground portion arranged in a different plane from the antenna pattern portion, and a connection portion connecting the antenna pattern portion and the ground portion;

arranging the radiator in a mold having a space receiving the radiator; and

injecting a resin material into the space through a resin material injection portion provided in the mold so that the resin material injected into the space forms a radiator frame allowing the antenna pattern portion to be embedded in an electronic device case.

8. The method of claim 7, wherein a guide pin, a contact pin or a guide pin and a contact pin, formed in the mold, are inserted into or make contact with a guide pin hole, a contact pin hole or a guide pin hole and a contact pin hole formed in the radiator.

9. The method of claim 7, further comprising forming a connection terminal portion on the other side of the radiator frame,

wherein the connection terminal portion is arranged in the mold having a recess receiving the connection terminal portion.

10. The method of claim 9, wherein the antenna pattern portion is arranged in contact with one surface of the mold, and the ground portion or the connection terminal portion is arranged in contact with the other surface of the mold.

11. A mold of manufacturing an electronic device case, the mold comprising:

an upper or lower mold receiving a radiator having an antenna pattern portion, a ground portion, and a connection portion connecting the antenna pattern portion and the ground portion to be arranged in different planes; and

a resin material injection portion provided through the upper mold, the lower mold, or the upper and lower molds, the resin material injection portion through which a resin material is injected into a space created between the upper and lower molds when the upper and lower molds are joined so that the space therebetween forms a radiator frame allowing the antenna pattern portion to be embedded in the electronic device case.

12. The mold of claim 11, wherein a guide pin, a contact pin or a guide pin and a contact pin, inserted into or making contact with a guide pin hole, a contact pin hole or a guide pinhole and a contact pin hole provided in the radiator frame, are provided in the upper mold, the lower mold or the upper and lower molds.

13. The mold of claim 11, further comprising a connection terminal portion provided on the other side of the radiator frame,

wherein a radiator support portion forming recess is provided in the upper mold, the lower mold, or the upper and lower molds to form a radiator support portion receiving the connection terminal portion and supporting the connection terminal portion.

14. An electronic device comprising:

a radiator frame manufactured by injection molding on a radiator having an antenna pattern portion, a ground portion and a connection portion connecting the ground portion and the connection portion to be arranged in different planes so that the antenna pattern portion is provided on one side of the radiator frame and the ground portion is provided on the other side thereof;

a case coupled with the radiator frame so that the antenna pattern portion is embedded in the case, and receiving the radiator frame so that the ground portion is connected to a ground; and

a circuit board electrically connected to the radiator.

15. The electronic device of claim 14, wherein the radiator comprises a connection terminal portion provided on the other side of the radiator frame, and

the connection terminal portion makes contact with the circuit board to transmit a signal thereto.