CIRCUIT MODULE AND ELECTRONIC EQUIPMENT USING THE CIRCUIT MODULE

• US 20100271788A1
• Filed: 08/09/2007
• Published: 10/28/2010
• Est. Priority Date: 08/09/2007
• Status: Abandoned Application

• Current Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Inventors: Sasaki, Satoshi, Inoue, Katsuhiro
• Application Number:
  US12/665,701
• Publication Number:
  US 20100271788A1
• Time in Patent Office: Days
• US Class Current: 361/748
• CPC Class Codes: H05K 2201/2018 Presence of a frame in a printed circuit or printed circuit assembly
• CPC Class Codes: H05K 2203/1316 Moulded encapsulation of mounted components
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence

Abstract

A circuit module of the present invention includes a circuit board, a plurality of electronic parts mounted on one face of the circuit board, a tubular body provided in an upstanding manner on the face in surrounding relation to the electronic parts, a turned-back portion turned back inwardly at a predetermined height position of the tubular body, and a resin portion formed by a sealing resin which is filled in the tubular body to a height reaching a distal end of the turned-back portion such that the resin covers at least part of the electronic parts. With this construction, the two surfaces of the sealing resin and the turned-back portion are joined together, so that the joining strength increases, and there can be provided the circuit module which is of the thin type and has a high strength. Further, through holes are provided at a region of the turned-back portion exposed from the sealing resin, and therefore a cavity within the turned-back portion (within a U-shaped portion), which is due to expansion of residual gas, can be eliminated, and besides the development of a convex portion formed on the upper surface of the resin by a cavity formed in the resin by gas moved from the interior of the turned-back portion into the resin and also the development of a crater-like irregularity portion formed on the upper surface of the resin portion when gas within the frame passes to the upper surface of the resin can be suppressed.

Claims

1. A circuit module comprising:

a circuit board which has a face;

a plurality of electronic parts arranged on the face of the circuit board;

a tubular body provided in an upstanding manner on the face so as to surround the electronic parts;

a turned-back portion turned back inwardly of the tubular body at a predetermined height position of the tubular body;

an extension portion extended from the turned-back portion;

a resin portion which is filled inside of the tubular body so as to cover at least a part of the electronic parts,

wherein the turned-back portion has a through hole;

wherein the end face of the tubular body has a shape of a polygon;

wherein the turned-back portion and the extension portion are provided at least one of sides of the polygon; and

wherein the resin portion contacts the tubular body, the extension portion and the turned-back portion and enters into the through hole.

2. The circuit module according to claim 1, wherein the turned-back portion is provided at one end face side of the tubular body;

and

wherein a region in an inner side surface of the tubular body, extended from other end face of the tubular body toward the one end face side by a predetermined distance, is jointed to the face of the circuit board.

5. The circuit module according to claim 2, wherein the other end face of the tubular body is turned back from the region is of the tubular body which is joined to the face of the circuit board, and is disposed at a position spaced apart from the face.

9. The circuit module according to claim 1, wherein the turned-back portion and the extension portion are provided at the end face of the tubular body over the entire periphery thereof.

10. The circuit module according to claim 1, wherein the turned-back portion is substantially perpendicular to the tubular body;

and

wherein the turned-back portion is substantially perpendicular to the extension portion.

11. The circuit module according to claim 1, wherein the tubular body, the turned-back portion and the extension portion configure a curved surface.

12. The circuit module according to claim 1 wherein the resin portion contacts both faces of the extension portion.

13. The circuit module according to claim 1 wherein an inner space formed by the tubular body, turned-back portion and the extension portion is entirely filled with the resin portion.

15. The circuit module according to claim 1, wherein the through hole is disposed at a corner of the polygon.

16. The circuit module according to claim 1, wherein the through hole is disposed at a position of the turned-back portion farthermost from the face of the circuit board.

17. The circuit module according to claim 1, wherein the through hole is disposed at a central part of the turned-back portion.

18. The circuit module according to claim 1, wherein the turned-back portion has a partially widened region.

20. The circuit module according to claim 1, comprising:

a lid member which covers an open end portion of the tubular body.

21. The circuit module according to claim 20, wherein the lid member contacts the turned-back portion over the entire periphery of the open end portion of the tubular body.

22. The circuit module according to claim 16, wherein the lid member contacts the resin portion.

24. An electronic equipment equipped with the circuit module according claim 1.

25. The circuit module according to claim 1, wherein the turned-back portion and the extension portion are provided at the longest side of the polygon.

26. The circuit module according to claim 25, wherein the turned-back portion and the extension portion are provided at a side of the polygon opposite to the longest side of the polygon.

3-4. -4. (canceled)

6-8. -8. (canceled)

14. (canceled)

19. (canceled)

23. (canceled)