FLEXIBLE ENCAPSULATING FILM SYSTEMS

• US 20100272933A1
• Filed: 12/19/2008
• Published: 10/28/2010
• Est. Priority Date: 12/28/2007
• Status: Active Grant

• Current Assignee: 3M Innovative Properties Company (3M Company)
• Original Assignee: 3M Innovative Properties Company (3M Company)
• Inventors: McCormick, Fred B., Roehrig, Mark A.
• Granted Patent: US 8,846,169 B2
• Time in Patent Office: Days
• US Class Current: 428/34.100
• CPC Class Codes: C09J 2203/326 for bonding electronic components such as wafers, chips or semiconductors
• CPC Class Codes: C09J 2301/302 the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
• CPC Class Codes: C09J 2400/163 in the substrate
• CPC Class Codes: C09J 2433/006 in the substrate
• CPC Class Codes: C09J 7/29 Laminated material metallised plastics C09J7/22
• CPC Class Codes: H10K 50/846 comprising getter material or desiccants
• CPC Class Codes: Y10T 428/13 Hollow or container type article [e.g., tube, vase, etc.]
• CPC Class Codes: Y10T 428/1303 Paper containing [e.g., paperboard, cardboard, fiberboard, etc.]
• CPC Class Codes: Y10T 428/1352 Polymer or resin containing [i.e., natural or synthetic]
• CPC Class Codes: Y10T 428/1359 Three or more layers [continuous layer]
• CPC Class Codes: Y10T 428/139 Open-ended, self-supporting conduit, cylinder, or tube-type article
• CPC Class Codes: Y10T 428/1476 Release layer
• CPC Class Codes: Y10T 428/249982 With component specified as adhesive or bonding agent
• CPC Class Codes: Y10T 428/2848 Three or more layers
• CPC Class Codes: Y10T 428/30 Self-sustaining carbon mass or layer with impregnant or other layer
• CPC Class Codes: Y10T 428/31935 Ester, halide or nitrile of addition polymer

Abstract

An encapsulating film system comprises (a) a flexible barrier film, (b) an adhesive on at least a portion of the flexible barrier film, and (c) a desiccant on at least a portion of the flexible barrier film or the adhesive.

Claims

1. An encapsulating film system comprising:

(a) a flexible barrier film comprising a multilayer film assembly comprising at least one inorganic film layer and at least one organic film layer;

(b) an adhesive on at least a portion of the flexible barrier film; and

(c) a desiccant on at least a portion of the flexible barrier film or the adhesive,

further wherein the multilayer film assembly comprises a flexible substrate overcoated with a first polymer layer having a Tg greater than or equal to that of HSPET and further overcoated with at least two inorganic barrier layers separated by at least one second polymer layer having a Tg greater than or equal to that of HSPET.

5. The encapsulating film system of claim 1 wherein the flexible substrate is light-transmissive.

6. The encapsulating film system of claim 1 wherein the flexible substrate has a Tg greater than or equal to that of HSPET.

7. The encapsulating film system of claim 1 wherein the first or second polymer layer comprises a polymer of cyclohexane dimethanol diacrylate ester, isobornyl methacrylate, cyclic diacrylate, or tris(2-hydroxy ethyl)isocyanurate triacrylate.

8. The encapsulating film system of claim 1 wherein at least one inorganic barrier layer comprises a metal oxide.

17. The encapsulating film system of claim 1 wherein the flexible barrier film comprises a diamond-like layer selected from a diamond-like carbon layer or a diamond-like glass layer.

18. The encapsulating film system of claim 17 wherein the diamond-like layer is overcoated on a polymer layer and the polymer layer is overcoated on a flexible substrate.

19. The encapsulating film system of claim 18 wherein the polymer layer and the diamond-like layer comprises a dyad and wherein the flexible barrier film has a plurality of the dyads overcoated on the substrate.

20. The encapsulating film system of claim 19 further comprising an additional layer between at least two of the dyads.

24. The encapsulating film system of claim 1 wherein the flexible barrier film comprises a diamond-like film layer.

25. The encapsulating film system of claim 24 wherein the diamond-like film layer was fabricated using a plasma formed from silicone oil.

26. The encapsulating film system of claim 25 wherein the diamond-like film layer is overcoated on a polymer layer.

42. The encapsulating film system of claim 1 further comprising a protective layer on the desiccant, wherein the protective layer is at least partially permeable to oxygen and moisture.

44. The encapsulating film system of claim 1 further comprising a release liner on the adhesive.

46. The encapsulating film system of claim 1 further comprising a moisture exposure indicator.

47. The encapsulating film system of claim 1 further comprising one or more spacer structures.

48. The encapsulating film system of claim 1 further comprising a functional layer or coating on the flexible barrier film.

49. The encapsulating film system of claim 1 wherein the barrier film is in a roll form and the backside of the barrier film comprises a release material.

2-4. -4. (canceled)

9-16. -16. (canceled)

21-23. -23. (canceled)

27-41. -41. (canceled)

43. (canceled)

45. (canceled)

50. A singulated encapsulating film system comprising one or more flexible barrier lids adhered to a carrier web, wherein the flexible barrier lid comprises:

(a) a flexible barrier film;

(b) an adhesive on at least a portion of the flexible barrier film; and

(c) a desiccant on at least a portion of the flexible barrier film or the adhesive,

wherein the singulated encapsulating film system comprises two or more flexible barrier lids.

52. The singulated encapsulating film system of claim 50 further comprising a continuous release liner covering all of the flexible barrier lids.

53. The singulated encapsulating film system of claim 50 wherein each flexible barrier lid further comprises a separate release liner.

54. The singulated encapsulating film system of claim 50 provided in a roll form, wherein the backside of the carrier web comprises a release material.

51. (canceled)

55-56. -56. (canceled)

57. A method of making a flexible encapsulation film system comprising:

(a) providing a flexible barrier film;

(b) depositing adhesive on at least a portion of the flexible barrier film;

(c) depositing desiccant on at least a portion of the flexible barrier film; and

(d) placing a release liner on the adhesive.

58-59. -59. (canceled)

60. A method of making a flexible encapsulation film system comprising:

(a) providing a flexible barrier film;

(b) depositing adhesive on at least a portion of the flexible barrier film;

(c) depositing desiccant on at least a portion of the adhesive; and

(d) placing a release liner on the adhesive.

62. The method of claim 60 wherein the release liner is used as a deposition mask for depositing the desiccant.

61. (canceled)