Flood exposure process for dual tone development in lithographic applications
First Claim
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1. A method of patterning a substrate, comprising:
- forming a layer of radiation-sensitive material on a substrate;
performing a patterned exposure of said layer of radiation-sensitive material;
performing a first post-exposure bake following said performing said patterned exposure;
performing positive-tone developing of said layer of radiation-sensitive material to remove first radiation-sensitive material portions from said substrate;
performing a flood exposure of said layer of radiation-sensitive material;
performing a second post-exposure bake following said performing said flood exposure; and
performing negative-tone developing of said layer of radiation-sensitive material to remove second radiation-sensitive material portions from said substrate.
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Abstract
A method and system for patterning a substrate using a dual tone development process is described. The method and system comprise a flood exposure of the substrate to improve process latitude for the dual tone development process.
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Citations
20 Claims
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1. A method of patterning a substrate, comprising:
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forming a layer of radiation-sensitive material on a substrate; performing a patterned exposure of said layer of radiation-sensitive material; performing a first post-exposure bake following said performing said patterned exposure; performing positive-tone developing of said layer of radiation-sensitive material to remove first radiation-sensitive material portions from said substrate; performing a flood exposure of said layer of radiation-sensitive material; performing a second post-exposure bake following said performing said flood exposure; and performing negative-tone developing of said layer of radiation-sensitive material to remove second radiation-sensitive material portions from said substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A platform configured for patterning a substrate, comprising:
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a track system configured to coat a substrate with a layer of radiation-sensitive material; a lithography system including a pattern exposure system configured to expose said substrate to patterned EM radiation; a flood exposure system configured to expose said substrate to un-patterned EM radiation; and a transfer system configured to transfer said substrate between said track system, said pattern exposure system, and said flood exposure system. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
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Specification