SILICONE RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICES AND AN OPTICAL SEMICONDUCTOR DEVICE
First Claim
1. A silicone resin composition, comprising(A) 100 parts by mass of an organopolysiloxane having a weight average molecular weight of from 500 to 20000, reduced to polystyrene, and represented by the following average compositional formula (1),
(CH3)aSi(OR1)b(OH)cO(4-a-b-c)/2
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(1)wherein R1 is a monovalent hydrocarbon group having 1 to 4 carbon atoms and a, b, and c are numbers satisfying the equations;
0.8<
=a<
=1.5, 0<
=b<
=0.3, 0.001<
=c<
=0.5, and 0.801<
=a+b+c<
2,(B) 3 to 200 parts by mass of a white pigment,(C) 400 to 1000 parts by mass of an inorganic filler other than the afore-mentioned white pigment,(D) 0.01 to 10 parts by mass of a condensation catalyst,(E) 1.0 to 10 parts by mass of an epoxy resin which is a derivative of isocyanuric acid,(F) 2 to 50 parts by mass of an organopolysiloxane comprising unit R2SiO and unit RSiO1.5, wherein R may be same or different and is a group selected from the group consisting of a hydroxyl group, a methyl group, an ethyl group, a propyl group, a cyclohexyl group, a phenyl group, a vinyl group and an allyl group, wherein at least a part of the afore-mentioned unit R2SiO repeats itself in series and the number of the repetition is 5 to 100, and wherein 0.5 to 10 mole % of the siloxane units comprising unit R2SiO and unit RSiO1.5 has a silanol group, and(G) 2 to 50 parts by mass of a linear dioraganopolysiloxane represented by the following formula (2).
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Abstract
Silicone resin composition for optical semiconductor devices, providing cured product wherein warpage in the devices is reduced and whiteness, heat-resistance, and light resistance are improved. The composition comprises: (A) an organopolysiloxane of the formula
(CH3)aSi(OR1)b(OH)cO(4-a-b-c)/2 (1)
wherein R1 is monovalent hydrocarbon and a, b, and c are numbers such that: 0.8<=a<=1.5, 0<=b<=0.3, 0.001<=c<=0.5, and 0.801<=a+b+c<2; (B) white pigment; (C) an inorganic filler other than the white pigment; (D) condensation catalyst; (E) an epoxy resin derived from isocyanuric acid; (F) an organopolysiloxane comprising unit R2SiO and unit RSiO1.5, wherein R is hydroxyl, methyl, ethyl, propyl, cyclohexyl, phenyl, vinyl, or allyl; and
(G) a linear diorganopolysiloxane of the formula
wherein R5 and R6 are alkyl, cyclohexyl, vinyl, phenyl, or allyl and n is an integer from 800 to 1200.
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Citations
3 Claims
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1. A silicone resin composition, comprising
(A) 100 parts by mass of an organopolysiloxane having a weight average molecular weight of from 500 to 20000, reduced to polystyrene, and represented by the following average compositional formula (1),
(CH3)aSi(OR1)b(OH)cO(4-a-b-c)/2-
(1)wherein R1 is a monovalent hydrocarbon group having 1 to 4 carbon atoms and a, b, and c are numbers satisfying the equations;
0.8<
=a<
=1.5, 0<
=b<
=0.3, 0.001<
=c<
=0.5, and 0.801<
=a+b+c<
2,(B) 3 to 200 parts by mass of a white pigment, (C) 400 to 1000 parts by mass of an inorganic filler other than the afore-mentioned white pigment, (D) 0.01 to 10 parts by mass of a condensation catalyst, (E) 1.0 to 10 parts by mass of an epoxy resin which is a derivative of isocyanuric acid, (F) 2 to 50 parts by mass of an organopolysiloxane comprising unit R2SiO and unit RSiO1.5, wherein R may be same or different and is a group selected from the group consisting of a hydroxyl group, a methyl group, an ethyl group, a propyl group, a cyclohexyl group, a phenyl group, a vinyl group and an allyl group, wherein at least a part of the afore-mentioned unit R2SiO repeats itself in series and the number of the repetition is 5 to 100, and wherein 0.5 to 10 mole % of the siloxane units comprising unit R2SiO and unit RSiO1.5 has a silanol group, and (G) 2 to 50 parts by mass of a linear dioraganopolysiloxane represented by the following formula (2). - View Dependent Claims (2, 3)
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Specification