SILICONE RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICES AND AN OPTICAL SEMICONDUCTOR DEVICE

• US 20100273927A1
• Filed: 04/23/2010
• Published: 10/28/2010
• Est. Priority Date: 04/24/2009
• Status: Active Grant

• Current Assignee: Shin-Etsu Chemical Company Limited
• Original Assignee: Shin-Etsu Chemical Company Limited
• Inventors: Sawada, Junichi, TAGUCHI, Yusuke, Hagiwara, Kenji
• Granted Patent: US 8,193,269 B2
• Time in Patent Office: Days
• US Class Current: 524/433
• CPC Class Codes: C08G 77/16 to hydroxyl groups
• CPC Class Codes: C08G 77/18 to alkoxy or aryloxy groups
• CPC Class Codes: C08G 77/20 containing silicon bound to unsaturated aliphatic groups C08G77/045 takes precedence
• CPC Class Codes: C08G 77/70 Siloxanes defined by use of the MDTQ nomenclature
• CPC Class Codes: C08K 3/22 of metals
• CPC Class Codes: C08L 2205/035 containing four or more polymers in a blend
• CPC Class Codes: C08L 2666/14 Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
• CPC Class Codes: C08L 2666/22 Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
• CPC Class Codes: C08L 2666/54 Inorganic substances
• CPC Class Codes: C08L 83/00 Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
• CPC Class Codes: C08L 83/04 Polysiloxanes
• CPC Class Codes: H01L 21/02126 the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
• CPC Class Codes: H01L 21/02216 the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane
• CPC Class Codes: H01L 21/3122 layers comprising polysiloxane compounds
• CPC Class Codes: H01L 2224/29499 Shape or distribution of the fillers
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/296 Organo-silicon compounds
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin

Abstract

Silicone resin composition for optical semiconductor devices, providing cured product wherein warpage in the devices is reduced and whiteness, heat-resistance, and light resistance are improved. The composition comprises: (A) an organopolysiloxane of the formula

(CH₃)_aSi(OR¹)_b(OH)_cO_(4-a-b-c)/2  (1)

wherein R¹ is monovalent hydrocarbon and a, b, and c are numbers such that: 0.8<=a<=1.5, 0<=b<=0.3, 0.001<=c<=0.5, and 0.801<=a+b+c<2; (B) white pigment; (C) an inorganic filler other than the white pigment; (D) condensation catalyst; (E) an epoxy resin derived from isocyanuric acid; (F) an organopolysiloxane comprising unit R₂SiO and unit RSiO_1.5, wherein R is hydroxyl, methyl, ethyl, propyl, cyclohexyl, phenyl, vinyl, or allyl; and
(G) a linear diorganopolysiloxane of the formula

wherein R⁵ and R⁶ are alkyl, cyclohexyl, vinyl, phenyl, or allyl and n is an integer from 800 to 1200.

Claims

1. A silicone resin composition, comprising

(A) 100 parts by mass of an organopolysiloxane having a weight average molecular weight of from 500 to 20000, reduced to polystyrene, and represented by the following average compositional formula (1),

(CH₃)_aSi(OR¹)_b(OH)_cO_(4-a-b-c)/2 

 

(1)

wherein R¹ is a monovalent hydrocarbon group having 1 to 4 carbon atoms and a, b, and c are numbers satisfying the equations;

0.8<

=a<

=1.5, 0<

=b<

=0.3, 0.001<

=c<

=0.5, and 0.801<

=a+b+c<

2,

(B) 3 to 200 parts by mass of a white pigment,

(C) 400 to 1000 parts by mass of an inorganic filler other than the afore-mentioned white pigment,

(D) 0.01 to 10 parts by mass of a condensation catalyst,

(E) 1.0 to 10 parts by mass of an epoxy resin which is a derivative of isocyanuric acid,

(F) 2 to 50 parts by mass of an organopolysiloxane comprising unit R₂SiO and unit RSiO_1.5, wherein R may be same or different and is a group selected from the group consisting of a hydroxyl group, a methyl group, an ethyl group, a propyl group, a cyclohexyl group, a phenyl group, a vinyl group and an allyl group, wherein at least a part of the afore-mentioned unit R₂SiO repeats itself in series and the number of the repetition is 5 to 100, and wherein 0.5 to 10 mole % of the siloxane units comprising unit R₂SiO and unit RSiO_1.5 has a silanol group, and

(G) 2 to 50 parts by mass of a linear dioraganopolysiloxane represented by the following formula (2).

2. The silicone resin composition according to claim 1, wherein white pigment (B) is at least one selected from the group consisting of titanium dioxide, magnesium oxide and alumina with an average particle diameter of from 0.05 to 10.0 μ

m and is contained in a content of 1 to 50% by mass, relative to the silicone resin composition; and

the total % by mass of white pigment (B) and inorganic filler (C) is 70 to 93% by mass, relative to the silicone resin composition.

3. A pre-molded package molded with the silicone resin composition according to claim 1 or 2.