INSULATION PAPER WITH HIGH THERMAL CONDUCTIVITY MATERIALS
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Abstract
The present invention provides for a high thermal conductivity (HTC) paper that comprises a host matrix, such as mica, and HTC materials intercalated into the host matrix. The HTC materials are comprised of at least one of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings on the nanofillers.
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Citations
40 Claims
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1-20. -20. (canceled)
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21. A structurally stable mica paper comprising:
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a host matrix comprising mica flakes defining an electrical insulation layer; and high thermal conductivity materials intercalated within interstices of the host matrix comprising mica flakes; wherein the high thermal conductivity materials are comprised of at least one of nanofillers and nanofillers with diamond like coatings, the at least one of nanofillers and nanofillers with diamond like coatings comprising an aspect ratio of from 3-100; and wherein the structurally stable mica paper is free from resin. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34)
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35. A high thermal conductivity composite material comprising:
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a mixture comprising mica flakelets and high thermal conductivity materials; wherein the high thermal conductivity materials are comprised of at least one of nanofillers and nanofillers with diamond like coatings; wherein the at least one of nanofillers and nanofillers with diamond like coatings comprise an aspect ratio of from 3-100; and wherein the high thermal conductivity composite material is free from resin. - View Dependent Claims (36, 37, 38, 39, 40)
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Specification