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SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

  • US 20100276765A1
  • Filed: 12/12/2008
  • Published: 11/04/2010
  • Est. Priority Date: 12/25/2007
  • Status: Active Grant
First Claim
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1. A method of manufacturing a semiconductor device comprising:

  • a bonding step of bonding a first substrate with optical transparency and a second substrate having a surface on which a functional element is provided to each other such that the functional element faces the first substrate;

    a thinning step of thinning at least one of the first and second substrates; and

    a through-hole forming step of forming a cavity and a through-hole communicated with the cavity in at least part of a bonding portion between the first and second substrates.

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