SHIELDING FOR A MICRO ELECTRO-MECHANICAL DEVICE AND METHOD THEREFOR
First Claim
Patent Images
1. A device comprising:
- a conductive substrate having a first side and a second side, the second side opposite the first side;
a micro electromechanical systems (MEMS) structure formed over the first side of the conductive substrate; and
a plurality of bond pads formed over the first side of the conductive substrate and electrically coupled to the first side of the conductive substrate.
18 Assignments
0 Petitions
Accused Products
Abstract
A device comprises a conductive substrate, a micro electromechanical systems (MEMS) structure, and a plurality of bond pads. The conductive substrate has a first side and a second side, the second side opposite the first side. The MEMS structure is formed over the first side of the conductive substrate. The plurality of bond pads are formed over the first side of the conductive substrate and electrically coupled to the first side of the conductive substrate. The conductive substrate and plurality of bond pads function to provide electrostatic shielding to the MEMS structure.
35 Citations
20 Claims
-
1. A device comprising:
-
a conductive substrate having a first side and a second side, the second side opposite the first side; a micro electromechanical systems (MEMS) structure formed over the first side of the conductive substrate; and a plurality of bond pads formed over the first side of the conductive substrate and electrically coupled to the first side of the conductive substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
-
-
10. A device comprising:
-
a conductive substrate having a first side and a second side, the second side opposite the first side, a cavity formed in the conductive substrate and having an opening on the first side; a micro electromechanical systems (MEMS) microphone diaphragm formed over the opening on the first side, the MEMS microphone diaphragm electrically isolated from the conductive substrate; a microphone backplate formed over and electrically isolated from the MEMS microphone diaphragm on the first side of the conductive substrate; and a plurality of bond pads formed over the conductive substrate on the first side and around the MEMS microphone diaphragm, each of the plurality of bond pads electrically coupled to the conductive substrate. - View Dependent Claims (11, 12, 13, 14, 15, 16)
-
-
17. A method for forming a device, the method comprising:
-
providing a conductive substrate; forming a micro electromechanical (MEMS) structure over a first side of the conductive substrate and electrically isolated from the conductive substrate; forming a plurality of bond pads over the first side of the conductive substrate around the MEMS structure; and electrically coupling each of the plurality of bond pads to the conductive substrate. - View Dependent Claims (18, 19, 20)
-
Specification