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INTEGRATED SENSOR CHIP UNIT

  • US 20100283110A1
  • Filed: 07/16/2010
  • Published: 11/11/2010
  • Est. Priority Date: 07/19/2003
  • Status: Abandoned Application
First Claim
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1. An integrated sensor chip unit comprising:

  • a measured-value pickup operative to determine measurement data;

    a circuit arrangement operative to enable a wireless power supply and interrogation of the measurement data; and

    an encapsulation surrounds the integrated sensor chip unit,wherein the measured-value pickup is formed as an integratable sensor and the circuit arrangement is embodied as an integrated semiconductor circuit module, the sensor and the semiconductor circuit module mechanically and electrically conductively connected to one another using a microsystems engineering technology;

    wherein the semiconductor circuit module further comprises a measured-value conditioning circuit with a digitization stage;

    a pipe system having at least one pipe, the at least one pipe having wall portions defined between an inner diameter and an outer diameter; and

    wherein the sensor chip unit is located entirely within a cavity located between the inner diameter and the outer diameter of the wall portions of the at least one pipe.

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