INTEGRATED SENSOR CHIP UNIT
First Claim
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1. An integrated sensor chip unit comprising:
- a measured-value pickup operative to determine measurement data;
a circuit arrangement operative to enable a wireless power supply and interrogation of the measurement data; and
an encapsulation surrounds the integrated sensor chip unit,wherein the measured-value pickup is formed as an integratable sensor and the circuit arrangement is embodied as an integrated semiconductor circuit module, the sensor and the semiconductor circuit module mechanically and electrically conductively connected to one another using a microsystems engineering technology;
wherein the semiconductor circuit module further comprises a measured-value conditioning circuit with a digitization stage;
a pipe system having at least one pipe, the at least one pipe having wall portions defined between an inner diameter and an outer diameter; and
wherein the sensor chip unit is located entirely within a cavity located between the inner diameter and the outer diameter of the wall portions of the at least one pipe.
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Abstract
An integrated sensor chip unit and fabrication method includes a measured-value pickup for determining measurement data and a circuit arrangement for enabling a wireless power supply and interrogation of the measurement data. The measured-value pickup is formed as an integratable sensor, and the circuit arrangement is formed as an integrated semiconductor circuit module. The sensor and the semiconductor circuit module are mechanically and electrically conductively connected to one another using one or more microsystems engineering techniques.
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Citations
13 Claims
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1. An integrated sensor chip unit comprising:
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a measured-value pickup operative to determine measurement data; a circuit arrangement operative to enable a wireless power supply and interrogation of the measurement data; and an encapsulation surrounds the integrated sensor chip unit, wherein the measured-value pickup is formed as an integratable sensor and the circuit arrangement is embodied as an integrated semiconductor circuit module, the sensor and the semiconductor circuit module mechanically and electrically conductively connected to one another using a microsystems engineering technology; wherein the semiconductor circuit module further comprises a measured-value conditioning circuit with a digitization stage; a pipe system having at least one pipe, the at least one pipe having wall portions defined between an inner diameter and an outer diameter; and wherein the sensor chip unit is located entirely within a cavity located between the inner diameter and the outer diameter of the wall portions of the at least one pipe. - View Dependent Claims (2, 3, 4, 5, 6)
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7. An integrated sensor chip unit comprising:
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means for determining measurement data; means for enabling a wireless power supply and interrogation of the measurement data that is mechanically and electrically conductively connected to the determining means using microsystems engineering means; and the means for enabling the wireless power supply and interrogation of the measurement data further comprises a measured-value conditioning circuit with a digitization stage; a pipe system having at least one pipe, the at least one pipe having wall portions defined between an inner diameter and an outer diameter; and wherein the sensor chip unit is located entirely within a cavity located between the inner diameter and the outer diameter of the wall portions of the at least one pipe. - View Dependent Claims (8, 9, 10, 11, 12, 13)
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Specification