Conductive Pattern and Method of Making

• US 20100283615A1
• Filed: 07/23/2010
• Published: 11/11/2010
• Est. Priority Date: 04/11/2003
• Status: Active Grant

• Current Assignee: Avery Dennison Retail Information Services LLC (Avery Dennison Corporation)
• Original Assignee: Avery Dennison Corporation
• Inventors: IYER, Pradeep S., EDWARDS, David N., LICON, Mark A., FORSTER, Ian J., COLEMAN, James P.
• Granted Patent: US 8,769,805 B2
• Time in Patent Office: Days
• US Class Current: 340/572.7
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07752 using an interposer
• CPC Class Codes: G06K 19/0776 the adhering arrangement being a layer of adhesive, so that the record carrier can function as a sticker
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: G06K 19/07783 the coil being planar
• CPC Class Codes: H05K 2203/0117 Pattern shaped electrode used for patterning, e.g. plating or etching
• CPC Class Codes: H05K 3/00 Apparatus or processes for manufacturing printed circuits
• CPC Class Codes: H05K 3/205 using a pattern electroplated or electroformed on a metallic carrier
• CPC Class Codes: H05K 3/245 Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
• CPC Class Codes: H05K 3/386 by the use of an organic polymeric bonding layer, e.g. adhesive
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49018 with other electrical component
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49224 with coating

Abstract

A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.

Claims

1. A method of making an RFID device, the method comprising:

printing graphics on a front surface of a dielectric substrate;

forming a conductive pattern on a conductive substrate; and

after the printing, adhesively transferring the conductive pattern to a back surface of the dielectric substrate.

2. The method of claim 1, wherein the adhesively transferring includes adhering the conductive pattern to an adhesive layer on the back surface of the dielectric substrate.

3. The method of claim 2, further comprising, after the adhesively transferring, covering the adhesive layer with a release layer.

4. The method of claim 1, further comprising operatively coupling a chip to the conductive pattern, wherein the conductive pattern functions as an antenna when coupled to the chip.

5. The method of claim 4, wherein the chip is part of an interposer that also includes conductive leads attached to contacts of the chip.

6. The method of claim 4, wherein the chip is coupled to the conductive pattern before the adhesively transferring.

7. The method of claim 4, wherein the chip is coupled to the conductive pattern after the adhesively transferring.

8. The method of claim 1, wherein the method is part of a roll-to-roll process for making a roll of RFID devices.

9. The method of claim 1, wherein the forming includes electroplating to deposit the conductive pattern on the conductive substrate.

10. An RFID device comprising:

a dielectric layer;

a conductive pattern antenna;

a chip operatively coupled to the antenna; and

an adhesive on the substrate;

wherein the adhesive both attaches the antenna to the dielectric layer, and is configured for attaching the RFID device to an object that is not part of the RFID device.

11. The RFID device of claim 10, further comprising a release layer covering the adhesive.

12. The RFID device of claim 10, wherein the adhesive is a pressure sensitive adhesive.

13. The RFID device of claim 10, wherein the dielectric layer is a printable layer.

14. The RFID device of claim 13, wherein printed matter is printed on the dielectric layer on an opposite side from the adhesive.

15. The RFID device of claim 10, as part of a roll of RFID devices.

16. A method of making conductive patterns, the method comprising:

plating on a conductive substrate to form a plurality of conductive patterns in a continuous sheet of conductive material;

separating the continuous conductive material sheet from the conductive substrate; and

singulating the conductive patterns.

17. The method of claim 16, wherein the conductive substrate is part of a roller.

18. The method of claim 16, wherein the conductive substrate is part of a belt.

19. The method of claim 16, wherein the separating includes separating from a location within a plating bath where the plating is performed.

20. The method of claim 16, wherein the separating includes separating by pulling along the conductive material sheet.

21. The method of claim 20, further comprising winding the conductive material sheet.

22. The method of claim 16, further comprising treating treated areas of the conductive substrate or foil to alter plating properties.

23. The method of claim 22, wherein the treating includes roughening the treated areas.

24. The method of claim 22, wherein the treating includes depositing a granular conductive seed layer on the treated areas.

25. The method of claim 16, wherein the plating and the separating are performed as a continuous process.

26. The method of claim 16, further comprising operatively coupling chips to the conductive patterns to form RFID devices.