Resistive touch panel

• US 20100283755A1
• Filed: 10/07/2009
• Published: 11/11/2010
• Est. Priority Date: 05/05/2009
• Status: Active Grant

• Current Assignee: Minlead, Ltd.
• Original Assignee: Minlead, Ltd.
• Inventors: Hsih, Lung-Sheng
• Granted Patent: US 8,279,198 B2
• Time in Patent Office: Days
• US Class Current: 345/174
• CPC Class Codes: G06F 3/045 using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact

Abstract

A resistive touch panel has a lower panel module and an upper panel module, an adhesive layer, a separating layer and a flexible circuit board. The lower panel module has a substrate, a lower conducting layer and a plurality of electrodes. The upper panel module has a protective film, an upper conducting layer, a pattern layer, an ink electrode mounted to electrically connect with the flexible circuit board, and an insulation layer. One end of the flexible circuit board and the separating layer are sandwiched between the top surface of the lower conducting layer and the top surface of the upper conducting layer. Given the foregoing structure, the components and steps for fabricating the resistive touch panel can be reduced since the pattern layer is directly printed on the bottom surface of the upper conducting layer. Therefore, fabricating yields are increased.

Claims

1. A resistive touch panel, comprising:

a lower panel module comprising;

a substrate having a top surface;

a lower conducting layer formed on the top surface of the substrate and having a top surface; and

a plurality of electrodes mounted on edges of the top surface of the lower conducting layer;

an upper panel module adhered to the lower panel module comprising;

a protective film having a bottom surface;

an upper conducting layer formed on the bottom surface of the protective film and having a bottom surface;

a pattern layer printed on the bottom surface of the upper conducting layer and having a bottom surface;

an ink electrode mounted on edges of the bottom surface of the upper conducting layer; and

an insulation layer formed on the bottom surface of the upper conducting layer to cover and isolate the ink electrode;

a flexible circuit board having two ends, one of which is electronically connected with the electrodes of the upper and lower conducting layers; and

a separating layer formed between the top surface of the lower conducting layer and the lower surface of the upper conducting layer.

2. The resistive touch panel as claimed in claim 1, wherein the substrate is a glass board.

3. The resistive touch panel as claimed in claim 1, wherein the ink electrode is combination of a printing ink and conducting particles.

4. The resistive touch panel as claimed in claim 2, wherein the ink electrode is combination of a printing ink and conducting particles.

5. The resistive touch panel as claimed in claim 3, wherein each of the lower conducting layer and the upper conducting layer are transparent electrodes.

6. The resistive touch panel as claimed in claim 4, wherein each of the lower conducting layer and the upper conducting layer are transparent electrodes.

7. The resistive touch panel as claimed in claim 3, wherein

the flexible circuit board has multiple terminals formed at a bottom thereof;

one leading line is formed on the lower conducting layer, one end of the leading line is aligned to one of the terminals of the flexible circuit board;

a conductor is formed at the other end of the leading line;

the adhesive layer further has a first through hole aligned to the conductor and receiving the conductor therein;

multiple conductive glues are respectively aligned to other terminals of the flexible circuit board;

the insulation layer further has a second through hole aligned to the first through hole of the adhesive layer to receive the conductor therein; and

the ink electrode is electronically connected to the corresponding terminal of the flexible circuit board through the conductor and the leading line.

8. The resistive touch panel as claimed in claim 4, wherein

the flexible circuit board has multiple terminals formed at a bottom thereof;

one leading line is formed on the lower conducting layer;

one end of the leading line is aligned to one of the terminals of the flexible circuit board;

a conductor is formed at the other end of the leading line;

the adhesive layer further has a first through hole aligned to the conductor and receiving the conductor therein;

multiple conductive glues are respectively aligned to other terminals of the flexible circuit board;

the insulation layer further has a second through hole aligned to the first through hole of the adhesive layer to receive the conductor therein; and

the ink electrode is electronically connected to the corresponding terminal of the flexible circuit board through the conductor and the leading line.

9. The resistive touch panel as claimed in claim 5, wherein

the flexible circuit board has multiple terminals formed at a bottom thereof;

one leading line is formed on the lower conducting layer;

one end of the leading line is aligned to one of the terminals of the flexible circuit board;

a conductor is formed at the other end of the leading line;

the adhesive layer further has a first through hole aligned to the conductor and receiving the conductor therein;

multiple conductive glues are respectively aligned to other terminals of the flexible circuit board;

the insulation layer further has a second through hole aligned to the first through hole of the adhesive layer to receive the conductor therein; and

the ink electrode is electronically connected to the corresponding terminal of the flexible circuit board through the conductor and the leading line.

10. The resistive touch panel as claimed in claim 6, wherein

the flexible circuit board has multiple terminals formed at a bottom thereof;

one leading line is formed on the lower conducting layer;

one end of the leading line is aligned to one of the terminals of the flexible circuit board;

a conductor is formed at the other end of the leading line;

the adhesive layer further has a first through hole aligned to the conductor and receiving the conductor therein;

multiple conductive glues are respectively aligned to other terminals of the flexible circuit board;

the insulation layer further has a second through hole aligned to the first through hole of the adhesive layer to receive the conductor therein; and

the ink electrode is electronically connected to the corresponding terminal of the flexible circuit board through the conductor and the leading line.