Power Semiconductor Module Including Substrates Spaced from Each Other
First Claim
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1. A power semiconductor module comprising:
- a module underside;
a module housing;
at least two substrates spaced from each other, each substrate comprising a topside facing an interior of the module housing and an underside facing away from the interior of the module housing;
whereinthe underside of each substrate comprises at least one portion simultaneously forming a portion of the module underside; and
at least one mounting means disposed between two adjacent substrates enables the power semiconductor module to be secured to a heatsink.
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Abstract
The invention relates to a power semiconductor module including a module underside, a module housing, and at least two substrates spaced from each other. Each substrate has a topside facing an interior of the module housing and an underside facing away from the interior of the module housing. The underside of each substrate includes at least one portion simultaneously forming a portion of the module underside. At least one mounting means disposed between two adjacent substrates enables the power semiconductor module to be secured to a heatsink.
58 Citations
25 Claims
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1. A power semiconductor module comprising:
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a module underside; a module housing; at least two substrates spaced from each other, each substrate comprising a topside facing an interior of the module housing and an underside facing away from the interior of the module housing; wherein the underside of each substrate comprises at least one portion simultaneously forming a portion of the module underside; and at least one mounting means disposed between two adjacent substrates enables the power semiconductor module to be secured to a heatsink. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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Specification