CIRCUIT DEVICE

• US 20100284159A1
• Filed: 07/15/2010
• Published: 11/11/2010
• Est. Priority Date: 09/27/2007
• Status: Active Grant

• Current Assignee: Semiconductor Components Industries LLC (ON Semiconductor Corporation)
• Original Assignee: Sanyo Semiconductor Company Limited (ON Semiconductor Corporation), Sanyo Electric Company Limited (Panasonic Holdings Corporation)
• Inventors: Koike, Yasuhiro, Sakamoto, Hideyuki, Tsukizawa, Masao, Saito, Hidefumi
• Granted Patent: US 8,102,655 B2
• Time in Patent Office: Days
• US Class Current: 361/752
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/4903 Connectors having different sizes, e.g. different diameters
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 2201/042 Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
• CPC Class Codes: H05K 2201/10318 Surface mounted metallic pins
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/3447 Lead-in-hole components H05K3/3415 takes precedence
• CPC Class Codes: H05K 5/065 sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding

Abstract

Provided is a circuit device capable of increasing the packaging density and preventing the thermal interference between circuit elements to be incorporated. In a hybrid integrated circuit device, a first circuit board and a second circuit board are fitted into a case member in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper surface of the first circuit board and a second circuit element is arranged on the upper surface of the second circuit board. Furthermore, inside the case member, provided is a hollow portion that is not filled with a sealing resin. Such a configuration prevents the second circuit element, which is a microcomputer, from operating unstably due to a heat generated in the first circuit element, which is a power transistor, for example.

Claims

1. A circuit device, comprising:

a case member;

a first circuit board fitted into a bottom portion of the case member;

a second circuit board fitted into the case member so as to define an internal space between the first and second circuit boards;

a semiconductor element mounted on a principal surface of the first circuit board; and

a circuit element mounted on a principal surface of the second circuit board and controlling the semiconductor element,

wherein the first circuit board is smaller than the second circuit board, and

the bottom portion of the case member has an opening connected to the internal space of the case member so that the internal space and the opening of the bottom portion form a conduit for air flow.

2. The circuit device of claim 1, further comprising a sealing resin covering at least the principal surface of the first circuit board and the semiconductor element.

3. The circuit device of claim 1, wherein the bottom portion of the case member has a plurality of openings connected to the internal space of the case member, and in plan view of the circuit device the first circuit board is surrounded by the openings.

4. The circuit device of claim 1, wherein a sidewall of the case member has an opening connected to the internal space of the case member.