LED PACKAGE AND METHOD FOR MANUFACTURING THE LED PACKAGE

• US 20100284198A1
• Filed: 09/16/2008
• Published: 11/11/2010
• Est. Priority Date: 09/20/2007
• Status: Active Grant

• Current Assignee: Lumileds LLC (Apollo Global Management, Inc.)
• Original Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Inventors: Willwohl, Harald, Kloosterman, Jan, Sweegers, Norbertus A.M.
• Granted Patent: US 9,593,810 B2
• Time in Patent Office: Days
• US Class Current: 362/520
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21K 9/66 Details of globes or covers forming part of the light source
• CPC Class Codes: F21K 9/90 Methods of manufacture
• CPC Class Codes: F21S 41/143 the main emission direction of the LED being parallel to the optical axis of the illuminating device
• CPC Class Codes: F21S 41/151 arranged in one or more lines
• CPC Class Codes: F21S 41/192 Details of lamp holders, terminals or connectors
• CPC Class Codes: F21S 43/14 Light emitting diodes [LED]
• CPC Class Codes: F21S 43/195 Details of lamp holders, terminals or connectors
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G03B 21/20 Lamp housings
• CPC Class Codes: G03B 21/2033 LED or laser light sources
• CPC Class Codes: H01L 2223/54426 for alignment
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H05K 1/0269 for visual or optical inspection
• CPC Class Codes: H05K 3/303 Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence

Abstract

A LED package (10) for use in a lamp as well as a method for manufacturing such kind of a LED package (10) are provided, wherein the LED package (10) comprises at least one LED (16), an optical element (18) for guiding light emitted by the LED (16), a cover (26) for covering at least partially electrical components (20, 22, 24) connectable to the LED (16) and at least one optical detectable reference mark (32; 36), wherein the optical element (18) comprises at least one first optical detectable mark (30) and the cover (26) comprises at least one second optical detectable mark (34), whereby the optical element (18) and the cover (26) are arranged and aligned both with respect to the same reference mark (32; 36) by means of the first mark (30) and the second mark (34). Due to the same reference (32; 36) for both the optical element (18) and the cover (26) manufacturing tolerances are not added to each other so that the accuracy of a correct arrangement is increased. Thus, the LED package (10) provides an improved optical performance, particularly an improved brightness and an improved luminous flux.

Claims

1. LED package for use in a lamp comprising:

at least one LED (16),

an optical element (18) for guiding light emitted by the LED (16),

a cover (26) for covering at least partially electrical components (20, 22, 24) connectable to the LED (16) and

at least one optical detectable reference mark (32;

36),

wherein the optical element (18) comprises at least one first optical detectable mark (30) and the cover (26) comprises at least one second optical detectable mark (34), whereby the optical element (18) and the cover (26) are arranged and aligned both with respect to the same reference mark (32;

36) by means of the first mark (30) and the second mark (34).

2. LED package according to claim 1, wherein a substrate (14) is provided, onto which the LED (16) is arranged, wherein the substrate (14) comprises the reference mark (32) or the substrate (14) comprises at least one third optical detectable mark (32) for arranging and aligning the substrate (14) with respect to the same reference mark (36).

3. LED package according to claim 1, wherein a heat sink (12) for leading away heat from the LED (16) is provided, to which the LED (16) is thermally connected, wherein the heat sink (12) comprises the reference mark (36) or the heat sink (12) comprises at least one forth optical detectable mark (36) for arranging and aligning the heat sink (12) with respect to the same reference mark (32).

4. LED package according to claim 1, wherein the LED (16) or a lighting field element comprising the LED (16) comprises at least one fifth optical detectable mark for arranging and aligning the LED (16) or the lighting field element with respect to the same reference mark (32;

36).

5. LED package according to claim 1, wherein between the cover (26) and the LED (16) and/or the optical element (18) a thermal barrier, particularly a gap (42), is provided.

6. LED package according to claim 1, wherein the cover (26) comprises a lower heat resistance than the heat resistance of the optical element (18).

7. LED package according to claim 1, wherein the cover (26) comprises at least one, particularly three, alignment element, particularly alignment protrusion (38), for aligning the cover (26) with respect to a housing of a lamp.

8. LED package according to claim 1, wherein the cover (26) comprises at least one, particularly tapered, connection opening (40) for connecting the cover (26) via the connection opening (40) particularly by laser welding.

9. Lamp, particularly headlight or taillight for motor vehicles, comprising a LED package (10) according to claim 1 and a housing, to which the LED package (10) is connected via the cover (26), wherein particularly the housing comprises at least one lens arranged adjacent to the optical element (18).

10. Method of manufacturing a LED package (10) according to claim 1, wherein a reference mark (32;

36) is provided at the LED package (10), the optical element (18) is arranged and aligned with respect to the reference mark (32;

36) via the first optical detectable mark (30) by means of an optical system and the cover (26) is arranged and aligned with respect to the same reference mark (32;

36) via the second optical detectable mark (34) by means of the optical system.